Inventor · disambiguated record
Jocel P. Gomez
Also filed as: GOMEZ JOCEL · GOMEZ JOCEL P
6 granted patents·8 pending applications·20 citations·filing 2007–2010
79Inventor score
Top patents by PatentIndex Score
14 records- 0177US8067273B2Self locking and aligning clip structure for semiconductor die packageGOMEZ JOCEL P·Filed 2010·Granted Nov 29, 2011·7 cites·9 claims
- 0270US7626249B2Flex clip connector for semiconductor deviceFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Dec 1, 2009·4 cites·20 claims
- 0368US7902657B2Self locking and aligning clip structure for semiconductor die packageFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Mar 8, 2011·4 cites·15 claims
- 0468US7737548B2Semiconductor die package including heat sinksFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Jun 15, 2010·4 cites·14 claims
- 0558US8119457B2Flip chip MLP with folded heat sinkNOQUIL JONATHAN A·Filed 2010·Granted Feb 21, 2012·1 cites·14 claims
- 0652US7824966B2Flex chip connector for semiconductor deviceFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Nov 2, 2010·0 cites·20 claims
- 0746US2011095417A1Leadless semiconductor device terminalFAIRCHILD SEMICONDUCTOR·Filed 2009·Application pending·0 cites
- 0844US2011095410A1Wafer level semiconductor device connectorFAIRCHILD SEMICONDUCTOR·Filed 2009·Application pending·0 cites
- 0941US2009261462A1Semiconductor package with stacked die assemblyGOMEZ JOCEL·Filed 2008·Application pending·0 cites
- 1037US2009294985A1Thin chip scale semiconductor packageGOMEZ JOCEL P·Filed 2008·Application pending·0 cites
- 1137US2009194856A1Molded package assemblyGOMEZ JOCEL P·Filed 2008·Application pending·0 cites
- 1237US2009127677A1Multi-Terminal Package Assembly For Semiconductor DevicesGOMEZ JOCEL P·Filed 2007·Application pending·0 cites
- 1337US2009127676A1Back to Back Die Assembly For Semiconductor DevicesGOMEZ JOCEL P·Filed 2007·Application pending·0 cites
- 1437US2010267206A1Semiconductor die package including heat sinksGOMEZ JOCEL P·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →