Inventor · disambiguated record
Chih-Peng Lee
Also filed as: LEE CHIH-PENG
11 granted patents·6 pending applications·95 citations·filing 2005–2020
89Inventor score
Files withFOXCONN TECH CO LTD9LEE CHIH-PENG5CHENG UEI PREC IND CO LTD1LIU TAY-JIAN1POWERCHIP SEMICONDUCTOR MFG CORP1
Top patents by PatentIndex Score
17 records- 0195US7552759B2Loop-type heat exchange deviceFOXCONN TECH CO LTD·Filed 2005·Granted Jun 30, 2009·29 cites·22 claims
- 0289US7775262B2Loop-type heat exchange deviceFOXCONN TECH CO LTD·Filed 2006·Granted Aug 17, 2010·19 cites·19 claims
- 0381US8804336B2Heat disspating apparatus and electronic deviceLEE CHIH-PENG·Filed 2011·Granted Aug 12, 2014·9 cites·15 claims
- 0479US7308802B2Refrigeration systemFOXCONN TECH CO LTD·Filed 2005·Granted Dec 18, 2007·9 cites·19 claims
- 0576US7565923B2Rotary total heat exchange apparatusFOXCONN TECH CO LTD·Filed 2005·Granted Jul 28, 2009·9 cites·7 claims
- 0672US7743818B2Heat exchange moduleFOXCONN TECH CO LTD·Filed 2006·Granted Jun 29, 2010·6 cites·19 claims
- 0770US7556689B2Device for spreading viscous thermal medium on heat dissipation device for electronic componentFOXCONN TECH CO LTD·Filed 2006·Granted Jul 7, 2009·2 cites·1 claims
- 0870US7472743B2Liquid cooling system suitable for removing heat from electronic componentsFOXCONN TECH CO LTD·Filed 2006·Granted Jan 6, 2009·5 cites·10 claims
- 0967US7444827B2Cooling device for multiple heat-generating componentsFOXCONN TECH CO LTD·Filed 2006·Granted Nov 4, 2008·4 cites·19 claims
- 1056US2013248152A1Heat pipe with one wick structure supporting another wick structure in positionFOXCONN TECH CO LTD·Filed 2012·Application pending·0 cites
- 1149US7131872B1Modular jack connector having anti-mismating elementCHENG UEI PREC IND CO LTD·Filed 2005·Granted Nov 7, 2006·3 cites·3 claims
- 1248US11329056B2SRAM device and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted May 10, 2022·0 cites·17 claims
- 1341US2006266498A1Liquid cooling system suitable for removing heat from electronic componentsLIU TAY-JIAN·Filed 2006·Application pending·0 cites
- 1438US2012275850A1Clip device and clip device assemblyLEE CHIH-PENG·Filed 2011·Application pending·0 cites
- 1535US2013087311A1Thermal moduleLEE CHIH-PENG·Filed 2011·Application pending·0 cites
- 1634US2013056192A1Heat dissipation device with fastenerLEE CHIH-PENG·Filed 2011·Application pending·0 cites
- 1729US2013070418A1Heat dissipation moduleLEE CHIH-PENG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →