Inventor · disambiguated record
Hideya Yagoura
Also filed as: YAGOURA HIDEYA
8 granted patents·174 citations·filing 1988–1993
88Inventor score
Files withMITSUBISHI ELECTRIC CORP8
Top patents by PatentIndex Score
8 records- 0179US5157478ATape automated bonding packaged semiconductor device incorporating a heat sinkMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·65 cites·23 claims
- 0262US5064706ACarrier tape including molten resin flow path element for resin packaged semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Nov 12, 1991·29 cites·1 claims
- 0360US4945391ASemiconductor device housing with laser diode and light receiving elementMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 31, 1990·20 cites·3 claims
- 0449US4839713APackage structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·17 cites·4 claims
- 0546US5055912ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Oct 8, 1991·16 cites·3 claims
- 0644US5359203ALaser OLB apparatus and method of mounting semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 25, 1994·13 cites·23 claims
- 0736US5412157ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 2, 1995·8 cites·9 claims
- 0834US4826068AOuter lead bonding device utilizing tape carriersMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 2, 1989·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →