Inventor · disambiguated record
Jungsoo Byun
Also filed as: BYUN JUNGSOO
5 granted patents·2 pending applications·7 citations·filing 2019–2024
70Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0193US11289456B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·3 cites·20 claims
- 0283US11088115B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
- 0376US2025140755A1Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0475US2024312959A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0569US12015014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·17 claims
- 0664US12218099B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·16 claims
- 0744US11581263B2Semiconductor package, and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →