Inventor · disambiguated record
Ramanan V. Chebiam
Also filed as: CHEBIAM RAMANAN · CHEBIAM RAMANAN V
34 granted patents·14 pending applications·242 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
48 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0297US6645567B2Electroless plating bath composition and method of usingINTEL CORP·Filed 2001·Granted Nov 11, 2003·85 cites·15 claims
- 0395US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0494US9391019B2Scalable interconnect structures with selective via postsINTEL CORP·Filed 2014·Granted Jul 12, 2016·26 cites·19 claims
- 0593US9997457B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2013·Granted Jun 12, 2018·12 cites·18 claims
- 0692US9691657B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2016·Granted Jun 27, 2017·6 cites·9 claims
- 0791US9165824B2Interconnects with fully clad linesINTEL CORP·Filed 2013·Granted Oct 20, 2015·11 cites·19 claims
- 0889US7470617B2Treating a liner layer to reduce surface oxidesINTEL CORP·Filed 2007·Granted Dec 30, 2008·20 cites·13 claims
- 0987US8519510B2Semiconductor structure having an integrated quadruple-wall capacitor for embedded dynamic random access memory (eDRAM) and method to form the sameDOYLE BRIAN S·Filed 2011·Granted Aug 27, 2013·9 cites·15 claims
- 1086US12266568B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2023·Granted Apr 1, 2025·0 cites·18 claims
- 1186US10700007B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·22 claims
- 1285US12394716B2Integrated circuit interconnect structures with graphene capINTEL CORP·Filed 2021·Granted Aug 19, 2025·1 cites·19 claims
- 1385US12354956B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1483US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 1582US11881432B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 1682US2025201629A1Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2025·Application pending·0 cites
- 1778US11862563B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2022·Granted Jan 2, 2024·0 cites·22 claims
- 1877US10832951B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2017·Granted Nov 10, 2020·1 cites·11 claims
- 1977US10068845B2Seam healing of metal interconnectsINTEL CORP·Filed 2014·Granted Sep 4, 2018·3 cites·16 claims
- 2077US7629252B2Conformal electroless deposition of barrier layer materialsINTEL CORP·Filed 2005·Granted Dec 8, 2009·5 cites·13 claims
- 2176US6908504B2Electroless plating bath composition and method of usingINTEL CORP·Filed 2003·Granted Jun 21, 2005·10 cites·11 claims
- 2275US7149085B2Electroosmotic pump apparatus that generates low amount of hydrogen gasINTEL CORP·Filed 2004·Granted Dec 12, 2006·20 cites·24 claims
- 2374US11569126B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·21 claims
- 2473US10553477B2Forming interconnects with self-assembled monolayersMAESTRE CARO ARANZAZU·Filed 2015·Granted Feb 4, 2020·3 cites·25 claims
- 2572US11328993B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·10 claims
- 2668US7372165B2Method for making a semiconductor device having increased conductive material reliabilityINTEL CORP·Filed 2005·Granted May 13, 2008·3 cites·10 claims
- 2765US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 2865US9385085B2Interconnects with fully clad linesINTEL CORP·Filed 2015·Granted Jul 5, 2016·1 cites·17 claims
- 2959US9349636B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2013·Granted May 24, 2016·0 cites·12 claims
- 3059US7279231B2Electroless plating structureINTEL CORP·Filed 2003·Granted Oct 9, 2007·5 cites·9 claims
- 3159US2025309100A1Low resistivity conductor subtractively patterned interconnects using layer transfer of microstructure engineered thin filmsINTEL CORP·Filed 2024·Application pending·0 cites
- 3257US10629525B2Seam healing of metal interconnectsINTEL CORP·Filed 2018·Granted Apr 21, 2020·0 cites·17 claims
- 3357US7229922B2Method for making a semiconductor device having increased conductive material reliabilityINTEL CORP·Filed 2003·Granted Jun 12, 2007·6 cites·12 claims
- 3455US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 3551US2017148739A1Selective diffusion barrier between metals of an integrated circuit deviceROBERTS JEANETTE M·Filed 2014·Application pending·0 cites
- 3651US2023197836A1Integrated circuits with max or mx conductive materialsINTEL CORP·Filed 2021·Application pending·0 cites
- 3748US2022199516A1Metal lines patterned by bottom-up fill metallization for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Application pending·0 cites
- 3847US2007004587A1Method of forming metal on a substrate using a Ruthenium-based catalystINTEL CORP·Filed 2005·Application pending·0 cites
- 3946US11532558B2Metallization barrier structures for bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 4046US2009315185A1Selective electroless metal deposition for dual salicide processBOYANOV BOYAN·Filed 2008·Application pending·0 cites
- 4145US11094587B2Use of noble metals in the formation of conductive connectorsINTEL CORP·Filed 2015·Granted Aug 17, 2021·0 cites·7 claims
- 4244US2009166867A1Metal interconnect structures for semiconductor devicesSIMKA HARSONO·Filed 2007·Application pending·0 cites
- 4343US2008003366A1Method of forming a conducting layer on a conducting and non-conducting substrateDUBIN VALERY M·Filed 2006·Application pending·0 cites
- 4443US2008296768A1Copper nucleation in interconnects having ruthenium layersCHEBIAM RAMANAN V·Filed 2006·Application pending·0 cites
- 4542US2004096592A1Electroless cobalt plating solution and plating techniquesFiled 2002·Application pending·0 cites
- 4640US2007065585A1Reducing electrical resistance in electrolessly deposited copper interconnectsCHEBIAM RAMANAN V·Filed 2005·Application pending·0 cites
- 4737US2004262772A1Methods for bonding wafers using a metal interlayerFiled 2003·Application pending·0 cites
- 4836US2019074217A1Conductive connectors having a ruthenium/aluminum-containing liner and methods of fabricating the sameINTEL CORP·Filed 2016·Application pending·0 cites
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