Inventor · disambiguated record
Thilo Stolze
Also filed as: STOLZE THILO
28 granted patents·300 citations·filing 2001–2014
96Inventor score
Technology areasH10W
Top patents by PatentIndex Score
28 records- 0193US8593817B2Power semiconductor module and method for operating a power semiconductor moduleBAYERER REINHOLD·Filed 2010·Granted Nov 26, 2013·19 cites·25 claims
- 0293US8514579B2Power semiconductor module including substrates spaced from each otherSTOLZE THILO·Filed 2010·Granted Aug 20, 2013·19 cites·24 claims
- 0393US8159822B2Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor moduleKANSCHAT PETER·Filed 2010·Granted Apr 17, 2012·20 cites·25 claims
- 0491US8319335B2Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assemblyBAYERER REINHOLD·Filed 2010·Granted Nov 27, 2012·14 cites·25 claims
- 0591US8087943B2Power semiconductor module including a contact elementSTOLZE THILO·Filed 2009·Granted Jan 3, 2012·26 cites·24 claims
- 0688US7919854B2Semiconductor module with two cooling surfaces and methodINFINEON TECHNOLOGIES AG·Filed 2008·Granted Apr 5, 2011·16 cites·21 claims
- 0785US7701054B2Power semiconductor module and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 20, 2010·13 cites·17 claims
- 0882US8134837B2Twist-secured assembly of a power semiconductor module mountable on a heat sinkHOHLFELD OLAF·Filed 2010·Granted Mar 13, 2012·7 cites·21 claims
- 0982US6431259B2Spring clip for fixing semiconductor modules to a heat sinkEUPEC GMBH & CO KG·Filed 2001·Granted Aug 13, 2002·63 cites·6 claims
- 1081US7291914B2Power semiconductor moduleEUPEC EUROPAEISCHE GES FUR LEI·Filed 2005·Granted Nov 6, 2007·11 cites·20 claims
- 1180US7477518B2Sub-assemblyINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 13, 2009·10 cites·16 claims
- 1279US7450389B2Sub-assemblyINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 11, 2008·10 cites·8 claims
- 1378US8446726B2Semiconductor module having an insert and method for producing a semiconductor module having an insertSCHLOERKE RALF·Filed 2010·Granted May 21, 2013·12 cites·23 claims
- 1478US7034395B2Power semiconductor module with cooling element and pressing apparatusEUPEC GMBH & CO KG·Filed 2004·Granted Apr 25, 2006·25 cites·19 claims
- 1575US8586420B2Power semiconductor arrangement and method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Nov 19, 2013·4 cites·18 claims
- 1674US8563364B2Method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Oct 22, 2013·4 cites·25 claims
- 1770US8598697B2Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor moduleKIRSCH OLAF·Filed 2011·Granted Dec 3, 2013·5 cites·8 claims
- 1866US9373563B2Semiconductor assembly having a housingSTOLZE THILO·Filed 2007·Granted Jun 21, 2016·3 cites·23 claims
- 1963US9891247B2U-shaped vertical shunt resistor for Power Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 13, 2018·1 cites·16 claims
- 2061US8643188B2Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connectorSTOLZE THILO·Filed 2011·Granted Feb 4, 2014·2 cites·24 claims
- 2160US6483128B2Connecting device for power semiconductor modules with compensation for mechanical stressesEUPEC EUROPAEISCHE GES F LEIST·Filed 2001·Granted Nov 19, 2002·13 cites·18 claims
- 2249US9337155B2Semiconductor component with moisture barrier for sealing semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 10, 2016·0 cites·19 claims
- 2346US8933569B2Pressure contact arrangement and method for producing a pressure contact arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 13, 2015·0 cites·19 claims
- 2446US6715203B2Substrate for power semiconductor modules with through-plating of solder and method for its productionEUPEC GMBH & CO KG·Filed 2001·Granted Apr 6, 2004·3 cites·7 claims
- 2544US8253237B2Semiconductor module arrangement and methodKANSCHAT PETER·Filed 2007·Granted Aug 28, 2012·0 cites·19 claims
- 2638US8338932B2Power semiconductor module with interconnected package portionsBORGHOFF GEORG·Filed 2010·Granted Dec 25, 2012·0 cites·13 claims
- 2738US8227913B2Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sinkSTOLZE THILO·Filed 2004·Granted Jul 24, 2012·0 cites·17 claims
- 2836US8215008B2Method for producing a housing part for a semiconductor moduleKIRSCH OLAF·Filed 2011·Granted Jul 10, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →