Inventor · disambiguated record
Jumpei Fujikata
Also filed as: FUJIKATA JUMPEI
57 granted patents·11 pending applications·597 citations·filing 2008–2024
98Inventor score
Top patents by PatentIndex Score
68 records- 0198USD649986SSealing ringFUJIKATA JUMPEI·Filed 2010·Granted Dec 6, 2011·438 cites·1 claims
- 0296USRE45687EPlating apparatus and plating methodEBARA CORP·Filed 2014·Granted Sep 29, 2015·14 cites·22 claims
- 0395US10641677B2Plating method and plating apparatusEBARA CORP·Filed 2019·Granted May 5, 2020·3 cites·5 claims
- 0493US8177944B2Plating apparatus and plating methodSAITO NOBUTOSHI·Filed 2008·Granted May 15, 2012·18 cites·21 claims
- 0592US10309030B2Plating method and plating apparatusEBARA CORP·Filed 2017·Granted Jun 4, 2019·2 cites·5 claims
- 0690US8486234B2Plating apparatus and plating methodSAITO NOBUTOSHI·Filed 2012·Granted Jul 16, 2013·5 cites·16 claims
- 0788US11315812B2Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatusEBARA CORP·Filed 2018·Granted Apr 26, 2022·5 cites·11 claims
- 0888US2025003108A1Powder supply apparatus and plating systemEBARA CORP·Filed 2024·Application pending·0 cites
- 0986US10577713B2Substrate holder, plating apparatus, and method for manufacturing substrate holderEBARA CORP·Filed 2017·Granted Mar 3, 2020·4 cites·14 claims
- 1086US9340891B2Plating method and plating apparatusEBARA CORP·Filed 2013·Granted May 17, 2016·2 cites·4 claims
- 1186US8864965B2Substrate holder and plating apparatusFUJIKATA JUMPEI·Filed 2011·Granted Oct 21, 2014·3 cites·7 claims
- 1285US9611563B2Plating method and plating apparatusEBARA CORP·Filed 2016·Granted Apr 4, 2017·1 cites·7 claims
- 1384US10100424B2Method of adjusting plating apparatus, and measuring apparatusEBARA CORP·Filed 2016·Granted Oct 16, 2018·1 cites·11 claims
- 1483US12116687B2Powder supply apparatus and plating systemEBARA CORP·Filed 2022·Granted Oct 15, 2024·0 cites·12 claims
- 1582US10633757B2Plating apparatus, plating method, and recording mediumEBARA CORP·Filed 2017·Granted Apr 28, 2020·3 cites·8 claims
- 1681US10273594B2Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling methodEBARA CORP·Filed 2017·Granted Apr 30, 2019·2 cites·21 claims
- 1779USD659175SSealing ringFUJIKATA JUMPEI·Filed 2011·Granted May 8, 2012·21 cites·1 claims
- 1878US11686647B2Leak check method, leak check apparatus, plating method, and plating apparatusEBARA CORP·Filed 2022·Granted Jun 27, 2023·0 cites·8 claims
- 1977US11385125B2Leak check method, leak check apparatus, plating method, and plating apparatusEBARA CORP·Filed 2019·Granted Jul 12, 2022·0 cites·16 claims
- 2077US11359304B2Powder supply apparatus and plating systemEBARA CORP·Filed 2018·Granted Jun 14, 2022·0 cites·7 claims
- 2177US10533262B2Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling methodEBARA CORP·Filed 2019·Granted Jan 14, 2020·0 cites·3 claims
- 2275US11047063B2Plating apparatus and plating methodEBARA CORP·Filed 2019·Granted Jun 29, 2021·0 cites·7 claims
- 2373US11604150B2Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage mediumEBARA CORP·Filed 2019·Granted Mar 14, 2023·2 cites·25 claims
- 2472US11371155B2Method and apparatus for processing a substrateEBARA CORP·Filed 2019·Granted Jun 28, 2022·0 cites·4 claims
- 2571US10487415B2Method of adjusting plating apparatus, and measuring apparatusEBARA CORP·Filed 2018·Granted Nov 26, 2019·0 cites·12 claims
- 2670US9972510B2Substrate cleaning apparatus and substrate cleaning methodEBARA CORP·Filed 2013·Granted May 15, 2018·2 cites·5 claims
- 2769US9376760B2Plating apparatus and method of cleaning substrate holderEBARA CORP·Filed 2013·Granted Jun 28, 2016·0 cites·5 claims
- 2868US11230789B2Method of removing liquid from seal of a substrate holderEBARA CORP·Filed 2019·Granted Jan 25, 2022·0 cites·8 claims
- 2968USD758973SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2015·Granted Jun 14, 2016·9 cites·1 claims
- 3068USD669439SElectrical contactFUJIKATA JUMPEI·Filed 2011·Granted Oct 23, 2012·15 cites·1 claims
- 3167US10119198B2Method of cleaning substrate holderEBARA CORP·Filed 2016·Granted Nov 6, 2018·0 cites·4 claims
- 3267USD725600SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2014·Granted Mar 31, 2015·10 cites·1 claims
- 3367USD651178SElectrical contact for use in a plating apparatusFUJIKATA JUMPEI·Filed 2010·Granted Dec 27, 2011·15 cites·1 claims
- 3466US10946351B2Paddle, plating apparatus equipped with the paddle, and plating methodEBARA CORP·Filed 2018·Granted Mar 16, 2021·0 cites·7 claims
- 3566US2020165737A1Copper oxide powder for use in plating of a substrateEBARA CORP·Filed 2020·Application pending·0 cites
- 3665US11717796B2Paddle, plating apparatus equipped with the paddle, and plating methodEBARA CORP·Filed 2021·Granted Aug 8, 2023·0 cites·7 claims
- 3765US2018105946A1Copper oxide powder for use in plating of a substrate, method of plating a substrate using the copper oxide powder, and method of managing plating solution using the copper oxide powderEBARA CORP·Filed 2017·Application pending·0 cites
- 3864US12191178B2Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatusEBARA CORP·Filed 2022·Granted Jan 7, 2025·0 cites·10 claims
- 3964US11891715B2Paddle, processing apparatus having the paddle, and method of producing the paddleEBARA CORP·Filed 2021·Granted Feb 6, 2024·0 cites·13 claims
- 4064US10508352B2Method and apparatus for processing a substrateEBARA CORP·Filed 2017·Granted Dec 17, 2019·0 cites·7 claims
- 4163US10914020B2Wave absorbing member attachable to paddle and plating apparatus including wave absorbing memberEBARA CORP·Filed 2018·Granted Feb 9, 2021·0 cites·9 claims
- 4263US10294578B2Plating apparatus and plating methodEBARA CORP·Filed 2015·Granted May 21, 2019·0 cites·2 claims
- 4362USD742329SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2015·Granted Nov 3, 2015·7 cites·1 claims
- 4459US2024383000A1Method of processing substrate and apparatus for processing substrateEBARA CORP·Filed 2024·Application pending·0 cites
- 4559US2024087919A1Substrate processing apparatus and protective layer forming methodEBARA CORP·Filed 2023·Application pending·0 cites
- 4657US11535949B2Substrate holder and plating apparatusEBARA CORP·Filed 2019·Granted Dec 27, 2022·0 cites·18 claims
- 4756US11447885B2Plating method and plating apparatusEBARA CORP·Filed 2020·Granted Sep 20, 2022·0 cites·12 claims
- 4856US10914019B2Plating apparatus and plating methodEBARA CORP·Filed 2018·Granted Feb 9, 2021·0 cites·5 claims
- 4956US10676838B2Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing methodEBARA CORP·Filed 2018·Granted Jun 9, 2020·0 cites·15 claims
- 5055USD705280SSealing ringEBARA CORP·Filed 2013·Granted May 20, 2014·8 cites·1 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →