Inventor · disambiguated record
Sonkwan Hwang
Also filed as: HWANG SONKWAN
3 granted patents·2 pending applications·3 citations·filing 2021–2024
54Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0194US11749586B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 0269US12046538B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 0368US2025062262A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US12166000B2Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 0548US2022367321A1Semiconductor device including through electrode and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →