Inventor · disambiguated record
Darrell D. Truhitte
Also filed as: TRUHITTE DARRELL · TRUHITTE DARRELL D
25 granted patents·2 pending applications·137 citations·filing 1995–2025
94Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC21SEMICONDUCTOR COMPONENTS IND4MOTOROLA INC1TRUHITTE DARRELL1
Top patents by PatentIndex Score
27 records- 0194US10199311B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 5, 2019·9 cites·13 claims
- 0290US9559007B1Plasma etch singulated semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jan 31, 2017·6 cites·20 claims
- 0389US10269609B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 23, 2019·4 cites·16 claims
- 0489US9899349B2Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 20, 2018·6 cites·15 claims
- 0587US10304798B2Semiconductor packages with leadframes and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 28, 2019·4 cites·13 claims
- 0687USD510728SSemiconductor device packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Oct 18, 2005·34 cites·1 claims
- 0786USD504874SSemiconductor device packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted May 10, 2005·32 cites·1 claims
- 0883US10163766B2Methods of forming leadless semiconductor packages with plated leadframes and wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 25, 2018·3 cites·19 claims
- 0977US10103072B2Damaging components with defective electrical couplingsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 16, 2018·2 cites·17 claims
- 1077US2025149412A1Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1176US10756006B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 1271US12424522B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 23, 2025·0 cites·13 claims
- 1364US5585281AProcess and apparatus for forming and testing semiconductor package leadsMOTOROLA INC·Filed 1995·Granted Dec 17, 1996·33 cites·8 claims
- 1462US10770332B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 1562US10770333B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 1662US10707111B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 7, 2020·0 cites·20 claims
- 1762US10399756B2Carrier tape with standoff unitsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 1860US11049843B2Semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1958US9892952B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Feb 13, 2018·0 cites·7 claims
- 2057US11145581B2Methods of forming leadless semiconductor packages with plated leadframes and wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 12, 2021·0 cites·8 claims
- 2157US10529632B2Damaging components with defective electrical couplingsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 7, 2020·0 cites·20 claims
- 2257US10093468B2Carrier tape with standoff unitsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 9, 2018·0 cites·20 claims
- 2355US11037903B2Plasma etch singulated semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 15, 2021·0 cites·15 claims
- 2447US6852574B1Method of forming a leadframe for a semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Feb 8, 2005·3 cites·13 claims
- 2544US9659876B1Wafer-scale marking systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 23, 2017·0 cites·20 claims
- 2640US2019393127A1Semiconductor package with integrated heat sinkSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
- 2736US8987054B2Semiconductor devices and methods of making the sameTRUHITTE DARRELL·Filed 2013·Granted Mar 24, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →