Inventor · disambiguated record
Eun-Kee Hong
Also filed as: HONG EUN-KEE
11 granted patents·3 pending applications·270 citations·filing 2001–2013
92Inventor score
Top patents by PatentIndex Score
14 records- 0194US6566229B2Method of forming an insulating layer in a trench isolation type semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 20, 2003·102 cites·14 claims
- 0290US6762126B2Method of forming an interlayer dielectric filmSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 13, 2004·52 cites·36 claims
- 0385US9330899B2Method of depositing thin filmASM IP HOLDING BV·Filed 2013·Granted May 3, 2016·8 cites·26 claims
- 0482US8530329B2Methods of fabricating semiconductor devices having various isolation regionsCHOI YONG-SOON·Filed 2011·Granted Sep 10, 2013·9 cites·11 claims
- 0582US7517817B2Method for forming a silicon oxide layer using spin-on glassSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 14, 2009·7 cites·13 claims
- 0682US6489252B2Method of forming a spin-on-glass insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 3, 2002·28 cites·11 claims
- 0781US6635586B2Method of forming a spin-on-glass insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 21, 2003·27 cites·11 claims
- 0880US7192891B2Method for forming a silicon oxide layer using spin-on glassSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 20, 2007·21 cites·47 claims
- 0963US8624354B2Semiconductor devices including 3-D structures with support pad structures and related methods and systemsKIM SHIN-HYE·Filed 2010·Granted Jan 7, 2014·3 cites·23 claims
- 1060US6645879B2Method of forming a silicon oxide layer of a semiconductor device and method of forming a wiring having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 11, 2003·7 cites·26 claims
- 1159US7358190B2Methods of filling gaps by deposition on materials having different deposition ratesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 15, 2008·6 cites·7 claims
- 1244US2009045483A1Semiconductor devices having trench isolation regions and methods of manufacturing semiconductor devices having trench isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1338US2004169005A1Methods for forming a thin film on an integrated circuit including soft baking a silicon glass filmFiled 2003·Application pending·0 cites
- 1436US2011207334A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →