Inventor · disambiguated record
Hsiu-Hsin Chung
Also filed as: CHUNG HSIU-HSIN
4 granted patents·1 pending application·58 citations·filing 1998–2025
73Inventor score
Top patents by PatentIndex Score
5 records- 0177US2025334538A1Structurally reinforced sensor and method for manufacturing the sameMEDTRONIC MINIMED INC·Filed 2025·Application pending·0 cites
- 0273US12372490B2Structurally reinforced sensor and method for manufacturing the sameMEDTRONIC MINIMED INC·Filed 2022·Granted Jul 29, 2025·0 cites·19 claims
- 0364US11448611B2Structurally reinforced sensor and method for manufacturing the sameMEDTRONIC MINIMED INC·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 0460US6002179ABonding pad structure for integrated circuit (I)WINBOND ELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·30 cites·22 claims
- 0556US5962919ABonding pad structure for integrated circuit (III)WINBOND ELECTRONICS CORP·Filed 1998·Granted Oct 5, 1999·28 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →