Inventor · disambiguated record

Yan Cing Lin

Also filed as: LIN YAN · LIN YAN CING

1 granted patent·1 pending application·4 citations·filing 2017–2024

25Inventor score

Technology areasE01D H10P

Files withCHINA ROAD & BRIDGE CORP1 TAIWAN SEMICONDUCTOR MFG CO LTD1

Top patents by PatentIndex Score

2 records

0181US10325796B2Apparatus and system for detecting wafer damageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·20 claims
0248US2025129557A1Construction method for splicing prefabricated segmental bridgesCHINA ROAD & BRIDGE CORP·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →