Inventor · disambiguated record
Kazuo Shimokawa
Also filed as: SHIMOKAWA KAZUO
40 granted patents·16 pending applications·160 citations·filing 2004–2025
96Inventor score
Files withTOSHIBA KK45TOSHIBA LIGHTING & TECHNOLOGY5SHIMOKAWA KAZUO2TOSHIBA MEMORY CORP2HAPPOYA AKIHIKO1
Top patents by PatentIndex Score
56 records- 0194US11688557B2Capacitor and etching methodTOSHIBA KK·Filed 2020·Granted Jun 27, 2023·3 cites·4 claims
- 0292US10964474B2Capacitor and capacitor moduleTOSHIBA KK·Filed 2020·Granted Mar 30, 2021·3 cites·14 claims
- 0392US8581291B2Semiconductor device and method for manufacturing the sameSHIMOKAWA KAZUO·Filed 2009·Granted Nov 12, 2013·33 cites·25 claims
- 0489US8754429B2Optical semiconductor device and method for manufacturing sameKOIZUMI HIROSHI·Filed 2011·Granted Jun 17, 2014·10 cites·38 claims
- 0586US8916901B2Semiconductor light emitting device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted Dec 23, 2014·8 cites·9 claims
- 0685US7514783B2Semiconductor moduleTOSHIBA KK·Filed 2005·Granted Apr 7, 2009·15 cites·13 claims
- 0784US8906716B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted Dec 9, 2014·3 cites·38 claims
- 0882US10090158B2Etching method, method of manufacturing semiconductor chip, and method of manufacturing articleTOSHIBA KK·Filed 2017·Granted Oct 2, 2018·3 cites·18 claims
- 0981US9087974B2Semiconductor light emitting device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Jul 21, 2015·5 cites·11 claims
- 1080US7633153B2Semiconductor moduleTOSHIBA KK·Filed 2007·Granted Dec 15, 2009·9 cites·2 claims
- 1179US8981412B2Optical semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Mar 17, 2015·4 cites·12 claims
- 1279USD521952SSemiconductor deviceTOSHIBA KK·Filed 2004·Granted May 30, 2006·26 cites·1 claims
- 1376US9885762B2Magnetic shielded package having magnetic shield membersTOSHIBA KK·Filed 2015·Granted Feb 6, 2018·3 cites·9 claims
- 1475US12362098B2Capacitor and etching methodTOSHIBA KK·Filed 2023·Granted Jul 15, 2025·0 cites·5 claims
- 1575US10128153B2Method of fabricating a semiconductor device and the semiconductor deviceTOSHIBA KK·Filed 2016·Granted Nov 13, 2018·2 cites·9 claims
- 1675US7781323B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Aug 24, 2010·7 cites·4 claims
- 1774US9202982B2Semiconductor light emitting device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted Dec 1, 2015·2 cites·17 claims
- 1872US10854466B2Etching method, method of manufacturing semiconductor chip, and method of manufacturing articleTOSHIBA KK·Filed 2019·Granted Dec 1, 2020·1 cites·15 claims
- 1971USD508682SSemiconductor deviceTOSHIBA KK·Filed 2004·Granted Aug 23, 2005·18 cites·1 claims
- 2069US11551864B2Capacitor and capacitor moduleTOSHIBA KK·Filed 2021·Granted Jan 10, 2023·0 cites·7 claims
- 2167US7999281B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 16, 2011·4 cites·12 claims
- 2265US9431588B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Aug 30, 2016·0 cites·4 claims
- 2363US11923287B2Method for manufacturing semiconductor device having chip stacked and moldedTOSHIBA KK·Filed 2021·Granted Mar 5, 2024·0 cites·4 claims
- 2461US2021217626A1Etching method and plating solutionTOSHIBA KK·Filed 2021·Application pending·0 cites
- 2559US2021280837A1Battery and manufacturing method of batteryTOSHIBA KK·Filed 2020·Application pending·0 cites
- 2659US2021280840A1Electrode group and batteryTOSHIBA KK·Filed 2020·Application pending·0 cites
- 2758US10991590B2Etching method and plating solutionTOSHIBA KK·Filed 2019·Granted Apr 27, 2021·0 cites·12 claims
- 2856US11588059B2Structural body and method of manufacturing the sameTOSHIBA KK·Filed 2021·Granted Feb 21, 2023·0 cites·6 claims
- 2956US9236551B2Light emitting device and luminaireTOSHIBA LIGHTING & TECHNOLOGY·Filed 2013·Granted Jan 12, 2016·1 cites·16 claims
- 3055US2021280841A1Bundling method, manufacturing method of battery, and bundling apparatusTOSHIBA KK·Filed 2020·Application pending·0 cites
- 3154US11227826B2Semiconductor device having chip stacked and moldedTOSHIBA KK·Filed 2019·Granted Jan 18, 2022·0 cites·5 claims
- 3254US8039857B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2009·Granted Oct 18, 2011·0 cites·6 claims
- 3352US11322308B2CapacitorTOSHIBA KK·Filed 2020·Granted May 3, 2022·0 cites·7 claims
- 3449US11862667B2CapacitorTOSHIBA KK·Filed 2020·Granted Jan 2, 2024·0 cites·21 claims
- 3549US11610860B2Wire bonding apparatus and wire bonding methodTOSHIBA KK·Filed 2020·Granted Mar 21, 2023·0 cites·7 claims
- 3649US10811391B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2019·Granted Oct 20, 2020·0 cites·9 claims
- 3748US10978358B2Processing system for a catalytic layer of a noble metal formed on a surface of a substrateTOSHIBA KK·Filed 2019·Granted Apr 13, 2021·0 cites·11 claims
- 3848US2025253215A1Semiconductor device, method for manufacturing semiconductor device, and substrateTOSHIBA KK·Filed 2025·Application pending·0 cites
- 3947US10658338B2Semiconductor device including a re-interconnection layer and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2018·Granted May 19, 2020·0 cites·11 claims
- 4047US2010006888A1Method of manufacturing optical semiconductor device, optical semiconductor device, and method of manufacturing optical semiconductor apparatusTOSHIBA KK·Filed 2009·Application pending·0 cites
- 4147US2014043803A1Light-emitting module and lighting apparatusTOSHIBA LIGHTING & TECHNOLOGY·Filed 2012·Application pending·0 cites
- 4247US2021313194A1Method for manufacturing semiconductor device and manufacturing apparatusTOSHIBA KK·Filed 2021·Application pending·0 cites
- 4346US10573603B2Semiconductor device having a three-sided textured substrateTOSHIBA KK·Filed 2018·Granted Feb 25, 2020·0 cites·10 claims
- 4446US8241937B2Optical semiconductor device and method of manufacturing optical semiconductor deviceHAPPOYA AKIHIKO·Filed 2011·Granted Aug 14, 2012·0 cites·2 claims
- 4544US10510726B2Semiconductor device, method for manufacturing semiconductor device, and method for manufacturing semiconductor packageTOSHIBA KK·Filed 2018·Granted Dec 17, 2019·0 cites·16 claims
- 4644US2015060894A1Light Emitting DeviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 4744US2020266089A1Carrier and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2020·Application pending·0 cites
- 4843US2015144970A1Light Emitting DeviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 4941US11270934B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2019·Granted Mar 8, 2022·0 cites·5 claims
- 5041US10438935B1Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Oct 8, 2019·0 cites·15 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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