Inventor · disambiguated record
Keiichiro Matsuo
Also filed as: MATSUO KEIICHIRO
16 granted patents·5 pending applications·16 citations·filing 2016–2024
88Inventor score
Top patents by PatentIndex Score
21 records- 0192US10964474B2Capacitor and capacitor moduleTOSHIBA KK·Filed 2020·Granted Mar 30, 2021·3 cites·14 claims
- 0288US10836888B2Transmission beltBANDO CHEMICAL IND·Filed 2019·Granted Nov 17, 2020·1 cites·6 claims
- 0383US10794450B2Transmission beltBANDO CHEMICAL IND·Filed 2019·Granted Oct 6, 2020·1 cites·4 claims
- 0483US10590988B2Machine tool and method for producing structure for machine toolDMG MORI CO LTD·Filed 2017·Granted Mar 17, 2020·2 cites·10 claims
- 0582US10090158B2Etching method, method of manufacturing semiconductor chip, and method of manufacturing articleTOSHIBA KK·Filed 2017·Granted Oct 2, 2018·3 cites·18 claims
- 0679US11508525B2Capacitor having trenches on both surfacesTOSHIBA KK·Filed 2020·Granted Nov 22, 2022·1 cites·8 claims
- 0778US10274927B2Method of machining workpiece using machine tool, and machine toolDMG MORI CO LTD·Filed 2016·Granted Apr 30, 2019·2 cites·9 claims
- 0875US10224209B2Etching method, article manufacturing method, and etching apparatusTOSHIBA KK·Filed 2016·Granted Mar 5, 2019·2 cites·9 claims
- 0972US10854466B2Etching method, method of manufacturing semiconductor chip, and method of manufacturing articleTOSHIBA KK·Filed 2019·Granted Dec 1, 2020·1 cites·15 claims
- 1069US11551864B2Capacitor and capacitor moduleTOSHIBA KK·Filed 2021·Granted Jan 10, 2023·0 cites·7 claims
- 1161US2021217626A1Etching method and plating solutionTOSHIBA KK·Filed 2021·Application pending·0 cites
- 1258US10991590B2Etching method and plating solutionTOSHIBA KK·Filed 2019·Granted Apr 27, 2021·0 cites·12 claims
- 1357US2025105177A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1457US2024355693A1Semiconductor device, semiconductor module, and method for manufacturing semiconductor moduleTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1556US12131966B2Semiconductor wafer and method of manufacturing semiconductor apparatusTOSHIBA KK·Filed 2021·Granted Oct 29, 2024·0 cites·11 claims
- 1650US2023071140A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2022·Application pending·0 cites
- 1749US11862667B2CapacitorTOSHIBA KK·Filed 2020·Granted Jan 2, 2024·0 cites·21 claims
- 1848US12107023B2Power moduleTOSHIBA KK·Filed 2021·Granted Oct 1, 2024·0 cites·10 claims
- 1948US10978358B2Processing system for a catalytic layer of a noble metal formed on a surface of a substrateTOSHIBA KK·Filed 2019·Granted Apr 13, 2021·0 cites·11 claims
- 2043US11410914B2Power moduleTOSHIBA KK·Filed 2020·Granted Aug 9, 2022·0 cites·10 claims
- 2133US2017076982A1Device manufacturing methodTOSHIBA KK·Filed 2016·Application pending·0 cites
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