Inventor · disambiguated record
Janet Patterson
Also filed as: PATTERSON JANET · PATTERSON JANET S · PATTERSON JANET SUZANNE
8 granted patents·1 pending application·208 citations·filing 1997–2010
89Inventor score
Technology areasH10W
Files withMAXWELL TECHNOLOGIES INC5MAXWELL ELECT COMPONENTS GROUP2MAXWELL TECHNOLOGIES LLC1SPACE ELECTRONICS INC1
Top patents by PatentIndex Score
9 records- 0187US5880403ARadiation shielding of three dimensional multi-chip modulesSPACE ELECTRONICS INC·Filed 1997·Granted Mar 9, 1999·100 cites·24 claims
- 0274US7696610B2Apparatus for shielding integrated circuit devicesMAXWELL TECHNOLOGIES INC·Filed 2006·Granted Apr 13, 2010·5 cites·5 claims
- 0373US6262362B1Radiation shielding of three dimensional multi-chip modulesMAXWELL ELECT COMPONENTS GROUP·Filed 1998·Granted Jul 17, 2001·45 cites·18 claims
- 0469US8018739B2Apparatus for shielding integrated circuit devicesMAXWELL TECHNOLOGIES LLC·Filed 2010·Granted Sep 13, 2011·3 cites·45 claims
- 0569US6858795B2Radiation shielding of three dimensional multi-chip modulesMAXWELL TECHNOLOGIES INC·Filed 2003·Granted Feb 22, 2005·16 cites·27 claims
- 0669US6613978B2Radiation shielding of three dimensional multi-chip modulesMAXWELL TECHNOLOGIES INC·Filed 2001·Granted Sep 2, 2003·17 cites·29 claims
- 0766US7191516B2Method for shielding integrated circuit devicesMAXWELL TECHNOLOGIES INC·Filed 2003·Granted Mar 20, 2007·11 cites·5 claims
- 0859US7382043B2Method and apparatus for shielding an integrated circuit from radiationMAXWELL TECHNOLOGIES INC·Filed 2002·Granted Jun 3, 2008·11 cites·22 claims
- 0935US2004217449A1Electronic component packagingMAXWELL ELECT COMPONENTS GROUP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →