Inventor · disambiguated record
Bo Yun Choi
Also filed as: CHOI BO YUN
12 granted patents·2 pending applications·16 citations·filing 1996–2018
84Inventor score
Top patents by PatentIndex Score
14 records- 0184US9416243B2Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resistLG CHEMICAL LTD·Filed 2014·Granted Aug 16, 2016·3 cites·22 claims
- 0281US9134609B2Photo-curable and thermo-curable resin compostion, and dry film solder resistLG CHEMICAL LTD·Filed 2014·Granted Sep 15, 2015·2 cites·25 claims
- 0374US8349538B2Photo-curable and thermo-curable resin composition, and a dry film solder resistLG CHEMICAL LTD·Filed 2011·Granted Jan 8, 2013·2 cites·2 claims
- 0467US8334092B2Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical propertyCHOI BO-YUN·Filed 2011·Granted Dec 18, 2012·2 cites·17 claims
- 0563US9880467B2Photo-curable and thermo-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jan 30, 2018·1 cites·16 claims
- 0661US9389504B2Photo-curable and thermo-curable resin composition, and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jul 12, 2016·0 cites·18 claims
- 0751US10795259B2Photo-curable and heat-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2017·Granted Oct 6, 2020·0 cites·20 claims
- 0848US9778566B2Photocurable and thermocurable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2015·Granted Oct 3, 2017·0 cites·23 claims
- 0946US9788434B2Preparation method for dry film solder resist and film laminate used thereinLG CHEMICAL LTD·Filed 2014·Granted Oct 10, 2017·0 cites·16 claims
- 1044US11361878B2Method for manufacturing insulating film and semiconductor packageLG CHEMICAL LTD·Filed 2018·Granted Jun 14, 2022·0 cites·17 claims
- 1143US2010055401A1Manufacturing method of film having micro-pattern thereon and film manufactured therebyLG CHEMICAL LTD·Filed 2008·Application pending·0 cites
- 1237US5657521AMethod for manufacturing suede-like woven fabricsSUNKYONG IND LTD·Filed 1996·Granted Aug 19, 1997·6 cites·6 claims
- 1332US2012070780A1Photosensitive resin composition, dry film solder resist, and circuit boardCHOI BO-YUN·Filed 2011·Application pending·0 cites
- 1431US9865480B2Printed circuit board including under-fill dam and fabrication method thereofCHOI BYUNG-JU·Filed 2011·Granted Jan 9, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →