Inventor · disambiguated record
Jon Bengston
Also filed as: BENGSTON JON · BENGSTON JON E
10 granted patents·2 pending applications·793 citations·filing 1990–2017
91Inventor score
Top patents by PatentIndex Score
12 records- 0197US5147692AElectroless plating of nickel onto surfaces such as copper or fused tungstonMACDERMID INC·Filed 1991·Granted Sep 15, 1992·287 cites·18 claims
- 0296US5235139AMethod for fabricating printed circuitsMACDERMID INCORPRATED·Filed 1990·Granted Aug 10, 1993·365 cites·12 claims
- 0388US6281090B1Method for the manufacture of printed circuit boards with plated resistorsMACDERMID INC·Filed 2000·Granted Aug 28, 2001·69 cites·28 claims
- 0473US6837923B2Polytetrafluoroethylene dispersion for electroless nickel plating applicationsCROTTY DAVID·Filed 2003·Granted Jan 4, 2005·15 cites·26 claims
- 0566US6692583B2Magnesium conversion coating composition and method of using sameFiled 2002·Granted Feb 17, 2004·11 cites·57 claims
- 0660US5474798AMethod for the manufacture of printed circuit boardsMACDERMID INC·Filed 1994·Granted Dec 12, 1995·24 cites·13 claims
- 0758US9603258B2Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefromUYEMURA INT CORP·Filed 2015·Granted Mar 21, 2017·0 cites·7 claims
- 0853US5431959AProcess for the activation of nickel - phosphorous surfacesMACDERMID INC·Filed 1994·Granted Jul 11, 1995·16 cites·16 claims
- 0951US9650719B1Method for electroless plating of palladium phosphorus directly on copper, and a plated component therefromUYEMURA INT CORP·Filed 2017·Granted May 16, 2017·0 cites·16 claims
- 1043US2005199587A1Non-chrome plating on plasticFiled 2004·Application pending·0 cites
- 1141US2005016416A1Stabilizer for electroless copper plating solutionFiled 2003·Application pending·0 cites
- 1236US5431739AProcess for cleaning and defluxing parts, specifically electronic circuit assembliesMACDERMID INC·Filed 1994·Granted Jul 11, 1995·6 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →