Inventor · disambiguated record
Seung-Weon Ha
Also filed as: HA SEUNG-WEON
4 granted patents·2 pending applications·16 citations·filing 2007–2018
70Inventor score
Top patents by PatentIndex Score
6 records- 0185US9500599B2Surface inspection apparatus for semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 22, 2016·7 cites·18 claims
- 0283US10147706B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·4 cites·20 claims
- 0370US8245902B2Wire bonding apparatus and method using the sameLEE YONG-JE·Filed 2011·Granted Aug 21, 2012·5 cites·27 claims
- 0454US10679972B2Method of manufacturing multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·12 claims
- 0543US2008142945A1Semiconductor package with redistribution layer of semiconductor chip directly contacted with substrate and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0631US2012056178A1Multi-chip packagesHAN WON-GIL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →