Inventor · disambiguated record
Thomas E. Love
Also filed as: LOVE THOMAS E
3 granted patents·1 pending application·2 citations·filing 2009–2014
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0155US8067829B2System and method for multi-chip module die extraction and replacementHUGHES JOHN A·Filed 2009·Granted Nov 29, 2011·2 cites·14 claims
- 0244US2014175675A1Devices and methods for stacking individually tested devices to form multi-chip electronic modulesBAE SYS INF & ELECT SYS INTEG·Filed 2014·Application pending·0 cites
- 0342US8338230B2System and method for multi-chip module die extraction and replacementHUGHES JOHN A·Filed 2011·Granted Dec 25, 2012·0 cites·7 claims
- 0438US8697457B1Devices and methods for stacking individually tested devices to form multi-chip electronic modulesSTURCKEN KEITH K·Filed 2012·Granted Apr 15, 2014·0 cites·15 claims
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