Inventor · disambiguated record
Yasunao Miyazawa
Also filed as: MIYAZAWA YASUNAO
6 granted patents·1 pending application·399 citations·filing 1989–2021
88Inventor score
Files withLINTEC CORP7
Top patents by PatentIndex Score
7 records- 0193US5118567AAdhesive tape and use thereofLINTEC CORP·Filed 1989·Granted Jun 2, 1992·100 cites·4 claims
- 0293US5110388AMethod of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tapeLINTEC CORP·Filed 1991·Granted May 5, 1992·150 cites·8 claims
- 0386US6584858B1Device and method for measuring adhesive strengthLINTEC CORP·Filed 2001·Granted Jul 1, 2003·42 cites·4 claims
- 0486US5356949AAdhesive composition comprising (meth)acrylate polymer and epoxy resinLINTEC CORP·Filed 1992·Granted Oct 18, 1994·75 cites·1 claims
- 0570US6331071B2Stirring deviceLINTEC CORP·Filed 2001·Granted Dec 18, 2001·16 cites·4 claims
- 0651US6244741B1Stirring deviceLINTEC CORP·Filed 1999·Granted Jun 12, 2001·16 cites·14 claims
- 0744US2023413389A1Wiring sheet and sheet-form heaterLINTEC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →