Inventor · disambiguated record
Bernd Scheibe
Also filed as: SCHEIBE BERND
4 granted patents·13 pending applications·53 citations·filing 2004–2023
73Inventor score
Top patents by PatentIndex Score
17 records- 0178USD595728SDisplay panel with graphical user interface for navigating contentYAHOO INC·Filed 2007·Granted Jul 7, 2009·35 cites·1 claims
- 0275US8165808B2Techniques for representing location informationSCHEIBE BERND·Filed 2007·Granted Apr 24, 2012·15 cites·18 claims
- 0360US8775420B2Text display of geo-referenced information based on relative distance to a user locationSCHEIBE BERND·Filed 2007·Granted Jul 8, 2014·3 cites·21 claims
- 0452US2013160832A1Marking of a substrate of a solar cellKRAUSE ANDREAS·Filed 2011·Application pending·0 cites
- 0550US2008300970A1Redemption techniques for electronic couponsYAHOO INC·Filed 2007·Application pending·0 cites
- 0649US2023356259A1Applicator and Operating Procedure or Using the Applicator According to the InventionATN HOELZEL GMBH·Filed 2023·Application pending·0 cites
- 0744US2007186173A1Instant messenger alerts and organization systemsYAHOO INC·Filed 2006·Application pending·0 cites
- 0841US2009100037A1Suggestive meeting points based on location of multiple usersYAHOO INC·Filed 2007·Application pending·0 cites
- 0941US2007186177A1Content navigation interfaces and associated methodsYAHOO INC·Filed 2006·Application pending·0 cites
- 1038US2022097095A1Method and Applicator for Continuous Sequential Application of Two or More Viscous Materials or FluidsATN HOELZEL GMBH·Filed 2020·Application pending·0 cites
- 1135US2006270109A1Manufacturing method for an electronic component assembly and corresponding electronic component assemblyBLASZCZAK STEPHAN·Filed 2005·Application pending·0 cites
- 1234US9880702B2Content structures and content navigation interfacesBOTH TORSTEN·Filed 2006·Granted Jan 30, 2018·0 cites·13 claims
- 1334US2005104227A1Substrate-based package for integrated circuitsFiled 2004·Application pending·0 cites
- 1434US2005098890A1Method for producing an adhesive bond and adhesive bond between a chip and a planar surfaceFiled 2004·Application pending·0 cites
- 1533US2005121807A1Arrangement of a chip package constructed on a substrate and substrate for production of the sameFiled 2004·Application pending·0 cites
- 1632US2007221318A1Adhesion tape and method for mounting a chip onto a substrateREISS MARTIN·Filed 2006·Application pending·0 cites
- 1732US2007224729A1Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assemblyREISS MARTIN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →