Inventor · disambiguated record
Kee Kwang Lau
Also filed as: LAU KEE K · LAU KEE KWANG
4 granted patents·5 pending applications·102 citations·filing 2002–2009
78Inventor score
Top patents by PatentIndex Score
9 records- 0193US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0278US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 0377US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 0446US8766438B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Jul 1, 2014·0 cites·22 claims
- 0541US2008150107A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTION PTES LTD·Filed 2008·Application pending·0 cites
- 0638US2006060937A1Embedded passive componentADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 0738US2007196979A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 0834US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 0934US2004084508A1Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →