Inventor · disambiguated record
Tan Kim Hwee
Also filed as: HWEE TAN K · HWEE TAN KIM
6 granted patents·1 pending application·225 citations·filing 2001–2009
86Inventor score
Top patents by PatentIndex Score
7 records- 0193US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0292US6510976B2Method for forming a flip chip semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jan 28, 2003·75 cites·41 claims
- 0385US6750082B2Method of assembling a package with an exposed die backside with and without a heatsink for flip-chipADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Jun 15, 2004·45 cites·58 claims
- 0478US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 0577US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 0666US7781870B2Wire bond and redistribution layer processMICRO DEVICES CORP CALIFORNIA·Filed 2009·Granted Aug 24, 2010·3 cites·12 claims
- 0735US2005087883A1Flip chip package using no-flow underfill and method of fabricationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →