Inventor · disambiguated record
Lea-Teng Lee
Also filed as: LEE LEA-TENG
3 granted patents·4 pending applications·2 citations·filing 2014–2022
51Inventor score
Top patents by PatentIndex Score
7 records- 0160US9865479B2Method of attaching components to printed cirucuit board with reduced accumulated tolerancesAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jan 9, 2018·1 cites·20 claims
- 0259US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 0345US2015351229A1Printed circuit board comprising co-planar surface pads and insulating dielectricAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Application pending·0 cites
- 0445US2023343729A1Integrated interposer for rf applicationAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 0535US9668340B1Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boardsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 30, 2017·0 cites·28 claims
- 0632US2017215278A1Coreless substrate having primer layers adjacent to bottom and top outer metal layersAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
- 0732US2017018501A1Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →