Inventor · disambiguated record
Patrick B. Halahan
Also filed as: HALAHAN PATRICK · HALAHAN PATRICK B
17 granted patents·1 pending application·1,871 citations·filing 1994–2018
96Inventor score
Files withTRU SI TECHNOLOGIES INC11ET WATER SYSTEMS INC3HALAHAN PATRICK B1SAVASTIOUK SERGEY1SIEMENS AG1
Top patents by PatentIndex Score
18 records- 0199US7060601B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jun 13, 2006·394 cites·23 claims
- 0299US7049170B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 23, 2006·429 cites·58 claims
- 0398US7186586B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2005·Granted Mar 6, 2007·61 cites·27 claims
- 0498US7034401B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2005·Granted Apr 25, 2006·101 cites·10 claims
- 0598US6787916B2Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavityTRU SI TECHNOLOGIES INC·Filed 2001·Granted Sep 7, 2004·210 cites·17 claims
- 0697US6498381B2Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating sameTRU SI TECHNOLOGIES INC·Filed 2001·Granted Dec 24, 2002·215 cites·50 claims
- 0795US6753205B2Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavityTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jun 22, 2004·96 cites·16 claims
- 0893US6844241B2Fabrication of semiconductor structures having multiple conductive layers in an openingTRU SI TECHNOLOGIES INC·Filed 2001·Granted Jan 18, 2005·84 cites·64 claims
- 0991US9414552B2System and method for smart irrigationET WATER SYSTEMS INC·Filed 2015·Granted Aug 16, 2016·27 cites·17 claims
- 1091US6498074B2Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and cornersTRU SI TECHNOLOGIES INC·Filed 2001·Granted Dec 24, 2002·98 cites·17 claims
- 1190US8948921B2System and method for smart irrigationHALAHAN PATRICK B·Filed 2011·Granted Feb 3, 2015·39 cites·62 claims
- 1287US9986696B2Irrigation smart controllers with programming and firmware updatingET WATER SYSTEMS INC·Filed 2014·Granted Jun 5, 2018·11 cites·11 claims
- 1387US7001825B2Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating sameTRU SI TECHNOLOGIES INC·Filed 2004·Granted Feb 21, 2006·53 cites·8 claims
- 1483US6448153B2Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and cornersTRU SI TECHNOLOGIES INC·Filed 2000·Granted Sep 10, 2002·30 cites·28 claims
- 1579US10779484B2Irrigation smart controllers with programming and firmware updatingET WATER SYSTEMS INC·Filed 2018·Granted Sep 22, 2020·2 cites·8 claims
- 1644US2005212127A1Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesSAVASTIOUK SERGEY·Filed 2005·Application pending·0 cites
- 1739US6121571APlasma generator ignition circuitTRUSI TECHNOLOGIES LLC·Filed 1999·Granted Sep 19, 2000·10 cites·12 claims
- 1832US5442673AFixed septum collimator for electron beam tomographySIEMENS AG·Filed 1994·Granted Aug 15, 1995·11 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →