Inventor · disambiguated record
Hongjun Yao
Also filed as: YAO HONGJUN · YAO HONGJUN MENZO
5 granted patents·3 pending applications·196 citations·filing 2003–2019
82Inventor score
Top patents by PatentIndex Score
8 records- 0191US7070419B2Land grid array connector including heterogeneous contact elementsNEOCONIX INC·Filed 2004·Granted Jul 4, 2006·76 cites·12 claims
- 0291US6916181B2Remountable connector for land grid array packagesNEOCONIX INC·Filed 2003·Granted Jul 12, 2005·59 cites·30 claims
- 0390US6869290B2Circuitized connector for land grid arrayNEOCONIX INC·Filed 2004·Granted Mar 22, 2005·56 cites·13 claims
- 0475US9024315B2Daisy chain connection for testing continuity in a semiconductor dieQUALCOMM INC·Filed 2013·Granted May 5, 2015·5 cites·42 claims
- 0545US11482844B2Monitoring system of cable laying stateZHEJIANG LANDI ELECTRIC POWER TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·10 claims
- 0644US2015123697A1Methods and apparatuses for ac/dc characterizationQUALCOMM INC·Filed 2014·Application pending·0 cites
- 0735US2013297981A1Low cost high throughput tsv/microbump probeGU SHIQUN·Filed 2012·Application pending·0 cites
- 0834US2015036278A1Composite socket probing platform for a mobile memory interfaceQUALCOMM INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →