Inventor · disambiguated record
Yuji Okawa
Also filed as: OKAWA YUJI
12 granted patents·10 pending applications·117 citations·filing 1995–2024
90Inventor score
Files withNITTO DENKO CORP15JTEKT CORP2ISHIGURO SHIGEKI1JAPAN SCIENCE & TECH CORP1NAKASHIMA KUNIMICHI1
Top patents by PatentIndex Score
22 records- 0177US2024218213A1Masking tape for forming electromagnetic wave shieldNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0275US7767556B2Adhesive sheet for laser dicing and its manufacturing methodNITTO DENKO CORP·Filed 2009·Granted Aug 3, 2010·4 cites·16 claims
- 0374US8740523B2Spindle deviceNAKASHIMA KUNIMICHI·Filed 2010·Granted Jun 3, 2014·5 cites·12 claims
- 0474US7564119B2Adhesive sheet for laser dicing and its manufacturing methodNITTO DENKO CORP·Filed 2005·Granted Jul 21, 2009·4 cites·10 claims
- 0573US6126772AMethod for resist removal, and adhesive or adhesive sheet for use in the sameNITTO DENKO CORP·Filed 1996·Granted Oct 3, 2000·43 cites·8 claims
- 0671US8827609B2Spindle device for machine toolOGURA KAZUNARI·Filed 2010·Granted Sep 9, 2014·6 cites·10 claims
- 0769US5759874AMethod for producing semiconductor element and adhesive sheet for adhering waferNITTO DENKO CORP·Filed 1995·Granted Jun 2, 1998·41 cites·6 claims
- 0865US2021269682A1Masking tape for forming electromagnetic wave shieldNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 0957US2019225840A1Masking tape for forming electromagnetic wave shieldNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 1056US7217638B2Wafer back surface treating method and dicing sheet adhering apparatusNITTO DENKO CORP·Filed 2004·Granted May 15, 2007·5 cites·2 claims
- 1156US2021040359A1Masking pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1253US8206068B2Main spindle deviceTAKASHIMA TOSHIHARU·Filed 2009·Granted Jun 26, 2012·2 cites·7 claims
- 1353US7091499B2Ultraviolet irradiating method and an apparatus using the sameNITTO DENKO CORP·Filed 2004·Granted Aug 15, 2006·4 cites·15 claims
- 1446US10858552B2Masking pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2016·Granted Dec 8, 2020·0 cites·3 claims
- 1546US2007275201A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1646US2011244160A1Adhesive tape or sheet with release linerNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1745US2011195250A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1844US7997838B2Main spindle deviceJTEKT CORP·Filed 2009·Granted Aug 16, 2011·0 cites·10 claims
- 1943US2007190318A1Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of workNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2039US6656662B1Method of forming a polymer molecule chainJAPAN SCIENCE & TECH CORP·Filed 2000·Granted Dec 2, 2003·3 cites·21 claims
- 2136US2011002570A1Spindle device for machine toolJTEKT CORP·Filed 2010·Application pending·0 cites
- 2234US2013108867A1Methylenebis (fatty acid amide) composition, adhesive sheet, and method for manufacturing thereofISHIGURO SHIGEKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →