Inventor · disambiguated record
Hidenori Takayanagi
Also filed as: TAKAYANAGI HIDENORI
6 granted patents·1 pending application·164 citations·filing 2005–2012
83Inventor score
Top patents by PatentIndex Score
7 records- 0196US7723838B2Package structure having semiconductor device embedded within wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted May 25, 2010·87 cites·7 claims
- 0293US7791206B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 7, 2010·42 cites·2 claims
- 0392US7843059B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 30, 2010·28 cites·5 claims
- 0478US7816177B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Oct 19, 2010·5 cites·6 claims
- 0551US8525355B2Semiconductor device, electronic apparatus and semiconductor device fabricating methodTAKAYANAGI HIDENORI·Filed 2007·Granted Sep 3, 2013·2 cites·3 claims
- 0638US8402644B2Method of manufacturing an electronic parts packaging structureGOMYO TOSHIO·Filed 2010·Granted Mar 26, 2013·0 cites·5 claims
- 0736US2012133056A1Semiconductor device, electronic apparatus and semiconductor device fabricating methodTAKAYANAGI HIDENORI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →