Inventor · disambiguated record
Thomas Oszinda
Also filed as: OSZINDA THOMAS
14 granted patents·2 pending applications·20 citations·filing 2009–2020
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8SCHALLER MATTHIAS4INFINEON TECHNOLOGIES AUSTRIA AG1OSRAM OLED GMBH1OSRAM OPTO SEMICONDUCTORS GMBH1
Top patents by PatentIndex Score
16 records- 0188US11581369B2Semiconductor switch element and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Feb 14, 2023·2 cites·15 claims
- 0284US9653400B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·5 cites·20 claims
- 0382US10128148B2Methods for fabricating semiconductor devices including surface treatment processesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·18 claims
- 0479US9972528B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 15, 2018·3 cites·20 claims
- 0578US10867923B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·2 cites·8 claims
- 0677US11322655B2Method for producing an optoelectronic component, and optoelectronic componentOSRAM OLED GMBH·Filed 2018·Granted May 3, 2022·1 cites·17 claims
- 0762US8575041B2Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatmentSCHALLER MATTHIAS·Filed 2011·Granted Nov 5, 2013·1 cites·25 claims
- 0862US8440579B2Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modificationSCHALLER MATTHIAS·Filed 2011·Granted May 14, 2013·1 cites·17 claims
- 0959US9666478B2Methods of forming wiring structures and methods of manufacturing semiconductor devicesOSZINDA THOMAS·Filed 2016·Granted May 30, 2017·1 cites·20 claims
- 1047US2017213786A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1146US8423320B2Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related modelsSCHALLER MATTHIAS·Filed 2009·Granted Apr 16, 2013·0 cites·26 claims
- 1241US10096549B2Semiconductor devices having interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 9, 2018·0 cites·20 claims
- 1340US11011504B2Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted May 18, 2021·0 cites·16 claims
- 1440US9929098B2Copper via with barrier layer and cap layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·19 claims
- 1540US9576848B2Method of treating a porous dielectric layer and a method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 21, 2017·0 cites·19 claims
- 1632US2010301494A1Re-establishing a hydrophobic surface of sensitive low-k dielectrics in microstructure devicesSCHALLER MATTHIAS·Filed 2010·Application pending·0 cites
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