Inventor · disambiguated record
Hironobu Moriyama
Also filed as: MORIYAMA HIRONOBU
11 granted patents·1 pending application·18 citations·filing 2004–2017
84Inventor score
Top patents by PatentIndex Score
12 records- 0178US9653371B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted May 16, 2017·4 cites·5 claims
- 0274US9202755B2Circuit connecting material and semiconductor device manufacturing method using sameDEXERIALS CORP·Filed 2013·Granted Dec 1, 2015·4 cites·9 claims
- 0371US10312125B2Protective tape and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2016·Granted Jun 4, 2019·1 cites·20 claims
- 0471US9741598B2Protective tape and method for manufacturing a semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted Aug 22, 2017·3 cites·9 claims
- 0569US7445868B2Battery packsSONY CHEM & INF DEVICE CORP·Filed 2007·Granted Nov 4, 2008·1 cites·8 claims
- 0661US2009148776A1Liquid absorbing sheet and nonaqueous electrolyte battery packSONY CHEM & INF DEVICE CORP·Filed 2009·Application pending·0 cites
- 0760US9957411B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted May 1, 2018·1 cites·14 claims
- 0857US7510767B2Liquid absorbing sheet and nonaqueous electrolyte battery packSONY CORP·Filed 2004·Granted Mar 31, 2009·3 cites·5 claims
- 0956US8802776B2Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unitKOYAMA TAICHI·Filed 2010·Granted Aug 12, 2014·1 cites·16 claims
- 1048US10062625B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2017·Granted Aug 28, 2018·0 cites·6 claims
- 1143US7399531B2Liquid absorbing sheet and nonaqueous electrolyte battery packSONY CORP·Filed 2004·Granted Jul 15, 2008·0 cites·22 claims
- 1241US10483148B2Protective tape and method for manufacturing semiconductor deviceDEXERIALS CORP·Filed 2016·Granted Nov 19, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →