Inventor · disambiguated record
James D. Meindl
Also filed as: MEINDL JAMES · MEINDL JAMES D · SHOTT JOHN D
23 granted patents·8 pending applications·800 citations·filing 1974–2012
97Inventor score
Files withGEORGIA TECH RES INST21UNIV LELAND STANFORD JUNIOR3KING JR CALVIN RICHARD1MEINDL JAMES D1MULE TONY1
Top patents by PatentIndex Score
31 records- 0198US7016569B2Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereofGEORGIA TECH RES INST·Filed 2003·Granted Mar 21, 2006·295 cites·39 claims
- 0294US7928563B23-D ICs with microfluidic interconnects and methods of constructing sameGEORGIA TECH RES INST·Filed 2008·Granted Apr 19, 2011·41 cites·20 claims
- 0393US7348786B2Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabricationGEORGIA TECH RES INST·Filed 2005·Granted Mar 25, 2008·32 cites·26 claims
- 0493US4152678ACascade charge coupled delay line device for compound delaysUNIV LELAND STANFORD JUNIOR·Filed 1976·Granted May 1, 1979·53 cites·11 claims
- 0590US7266267B2Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereofGEORGIA TECH RES INST·Filed 2005·Granted Sep 4, 2007·14 cites·52 claims
- 0690US6528349B1Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testabilityGEORGIA TECH RES INST·Filed 2000·Granted Mar 4, 2003·69 cites·21 claims
- 0789US7135777B2Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2003·Granted Nov 14, 2006·49 cites·29 claims
- 0888US3979711AUltrasonic transducer array and imaging systemUNIV LELAND STANFORD JUNIOR·Filed 1974·Granted Sep 7, 1976·46 cites·4 claims
- 0986US6690081B2Compliant wafer-level packaging devices and methods of fabricationGEORGIA TECH RES INST·Filed 2001·Granted Feb 10, 2004·44 cites·54 claims
- 1085US8563365B2Air-gap C4 fluidic I/O interconnects and methods of fabricating sameKING JR CALVIN RICHARD·Filed 2012·Granted Oct 22, 2013·19 cites·20 claims
- 1184US4285001AMonolithic distributed resistor-capacitor device and circuit utilizing polycrystalline semiconductor materialUNIV LELAND STANFORD JUNIOR·Filed 1978·Granted Aug 18, 1981·28 cites·12 claims
- 1281US6788867B2Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationGEORGIA TECH RES INST·Filed 2003·Granted Sep 7, 2004·21 cites·19 claims
- 1380US6785458B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2002·Granted Aug 31, 2004·19 cites·13 claims
- 1478US7468558B2Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2006·Granted Dec 23, 2008·7 cites·29 claims
- 1578US6606432B2Phase mask consisting of an array of multiple diffractive elements for simultaneous accurate fabrication of large arrays of optical couplers and method for making sameGEORGIA TECH RES INST·Filed 2001·Granted Aug 12, 2003·19 cites·28 claims
- 1674US6807352B2Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2002·Granted Oct 19, 2004·15 cites·15 claims
- 1769US6954576B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2004·Granted Oct 11, 2005·9 cites·10 claims
- 1858US7906255B2Photo-masks and methods of fabricating periodic optical structuresGEORGIA TECH RES INST·Filed 2008·Granted Mar 15, 2011·2 cites·20 claims
- 1956US7132736B2Devices having compliant wafer-level packages with pillars and methods of fabricationGEORGIA TECH RES INST·Filed 2002·Granted Nov 7, 2006·7 cites·6 claims
- 2055US6947651B2Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2002·Granted Sep 20, 2005·5 cites·13 claims
- 2154US7935459B2Photo-masks and methods of fabricating surface-relief grating diffractive devicesGEORGIA TECH RES INST·Filed 2007·Granted May 3, 2011·2 cites·11 claims
- 2250US7554347B2High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of useGEORGIA TECH RES INST·Filed 2003·Granted Jun 30, 2009·4 cites·28 claims
- 2345US7994590B2High dielectric constant insulators and associated fabrication methodsGEORGIA TECH RES INST·Filed 2007·Granted Aug 9, 2011·0 cites·20 claims
- 2445US2008212921A1Optical interconnect devices and structures based on metamaterialsGEORGIA TECH RES INST·Filed 2008·Application pending·0 cites
- 2544US2007106964A1Optimized microchip and related methodsMEINDL JAMES D·Filed 2006·Application pending·0 cites
- 2641US2009098468A1Photo-masks and methods of fabricating photonic crystal devicesGEORGIA TECH RES INST·Filed 2007·Application pending·0 cites
- 2740US2004184704A1Curved metal-polymer dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and uses thereofFiled 2003·Application pending·0 cites
- 2839US2003012539A1Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationFiled 2002·Application pending·0 cites
- 2937US2005257709A1Systems and methods for three-dimensional lithography and nano-indentationMULE TONY·Filed 2003·Application pending·0 cites
- 3033US2003076154A1Controlling circuit power consumption through supply voltage controlFiled 2002·Application pending·0 cites
- 3133US2003076153A1Controlling circuit power consumption through body voltage controlFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →