Inventor · disambiguated record

Jong Hyock Park

Also filed as: PARK JONG HYOCK

1 granted patent·2 pending applications·0 citations·filing 2018–2022

7Inventor score

Technology areasH10W

Files withSK HYNIX INC3

Top patents by PatentIndex Score

3 records

0142US11501981B2Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chaseSK HYNIX INC·Filed 2021·Granted Nov 15, 2022·0 cites·15 claims
0242US2024014175A1Stack package including semiconductor dies and encapsulantSK HYNIX INC·Filed 2022·Application pending·0 cites
0327US2019043833A1Semiconductor packages including a plurality of stacked diesSK HYNIX INC·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →