Inventor · disambiguated record
Byeung Gyu Chang
Also filed as: CHANG BYEUNG G · CHANG BYEUNG GYU
9 granted patents·16 pending applications·20 citations·filing 2002–2015
81Inventor score
Top patents by PatentIndex Score
25 records- 0174US7926154B2Method of manufacturing multi-layer ceramic condenserSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 19, 2011·8 cites·5 claims
- 0264US7819995B2Manufacturing method of multi-layer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 26, 2010·2 cites·5 claims
- 0361US8114303B2Method of manufacturing ceramic probe cardPARK HO JOON·Filed 2009·Granted Feb 14, 2012·2 cites·12 claims
- 0458US2010116676A1Method of fabricating probe pin for probe cardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0557US8198198B2Method for forming electrode pattern of ceramic substrateYOO WON HEE·Filed 2009·Granted Jun 12, 2012·1 cites·8 claims
- 0655US6714101B2Noise reduction filter arraySAMSUNG ELECTRO MECH·Filed 2002·Granted Mar 30, 2004·7 cites·7 claims
- 0753US7474052B2Plasma display panel with display electrodes formed in intersecting portionsSAMSUNG ELECTRO MECH·Filed 2005·Granted Jan 6, 2009·0 cites·10 claims
- 0851US2010307801A1Multilayer ceramic substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0951US2010051172A1Method for manufacturing ceramic green sheet and method for manufacturing multilayer ceramic circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1050US2011011631A1Ceramic substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1150US2010300733A1Multilayer ceramic board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1249US8106306B2Ceramic multi-layer circuit substrate and manufacturing method thereofYOO WON HEE·Filed 2009·Granted Jan 31, 2012·0 cites·6 claims
- 1347US8198908B2Probe substrate with auxiliary contact pads and probe card therewithYOO WON HEE·Filed 2009·Granted Jun 12, 2012·0 cites·9 claims
- 1446US9101064B2Thin film electrode ceramic substrate and method for manufacturing the sameYOO WON HEE·Filed 2012·Granted Aug 4, 2015·0 cites·6 claims
- 1546US2010031504A1Method of manufacturing probe cardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1646US2010039129A1Probe cardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1746US2010040984A1Method of fabricating micro electro-mechanical componentSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1845US2013032384A1Thin film electrode ceramic substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1944US2007289691A1Method of manufacturing non-shrinkage ceramic substrateKIM YONG S·Filed 2007·Application pending·0 cites
- 2042US2009294297A1Method of forming plating layerSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2141US2012037610A1Ceramic firing furnaceYOO WON HEE·Filed 2011·Application pending·0 cites
- 2238US2013017504A1FurnaceSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2338US2011148447A1Multilayer ceramic substrate and probe board using pillar-type conductor and fabricating methods of the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2437US2012048602A1Method of manufacturing ceramic substrate for probe card and ceramic substrate for probe cardLEE TAEK JUNG·Filed 2011·Application pending·0 cites
- 2534US2016007486A1Package substrateSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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