Inventor · disambiguated record
Keishiro Okamoto
Also filed as: OKAMOTO KEISHIRO
16 granted patents·5 pending applications·85 citations·filing 2002–2015
92Inventor score
Top patents by PatentIndex Score
21 records- 0186US7557014B2Semiconductor system-in-packageFUJITSU LTD·Filed 2006·Granted Jul 7, 2009·12 cites·6 claims
- 0284US7176556B2Semiconductor system-in-packageFUJITSU LTD·Filed 2002·Granted Feb 13, 2007·33 cites·13 claims
- 0376US8866312B2Semiconductor apparatus, method for manufacturing the same and electric deviceTANI MOTOAKI·Filed 2012·Granted Oct 21, 2014·4 cites·13 claims
- 0476US7622184B2Multilevel interconnection board and method of fabricating the sameFUJITSU LTD·Filed 2006·Granted Nov 24, 2009·2 cites·7 claims
- 0576US7246435B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2005·Granted Jul 24, 2007·5 cites·10 claims
- 0673US7420130B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2007·Granted Sep 2, 2008·4 cites·7 claims
- 0770US8257542B2Multilevel interconnection board and method of fabricating the sameOKAMOTO KEISHIRO·Filed 2009·Granted Sep 4, 2012·1 cites·6 claims
- 0870US6781290B2Piezoelectric actuator, method of manufacturing the same, ink-jet head using the same, and ink-jet printerFUJITSU LTD·Filed 2002·Granted Aug 24, 2004·12 cites·54 claims
- 0968US9462693B2Electronic device and method of manufacturing electronic deviceFUJITSU LTD·Filed 2014·Granted Oct 4, 2016·2 cites·14 claims
- 1064US9177938B2Method for manufacturing semiconductor apparatusFUJITSU LTD·Filed 2014·Granted Nov 3, 2015·1 cites·11 claims
- 1158US8962470B2Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusMIZUKOSHI MASATAKA·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 1258US8492784B2Semiconductor device and method for producing the same, and power supplyOKAMOTO KEISHIRO·Filed 2011·Granted Jul 23, 2013·1 cites·20 claims
- 1356US8674520B2Semiconductor device, method for manufacturing the same, and power supply unitIMAIZUMI NOBUHIRO·Filed 2012·Granted Mar 18, 2014·1 cites·19 claims
- 1455US9082756B2Semiconductor device and power source deviceFUJITSU LTD·Filed 2014·Granted Jul 14, 2015·0 cites·8 claims
- 1555US6806118B2Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structureFUJITSU LTD·Filed 2003·Granted Oct 19, 2004·6 cites·14 claims
- 1648US2015132865A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 1747US2005161814A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1842US8728867B2Semiconductor device, manufacturing method of semiconductor device, and power source deviceSHIMIZU KOZO·Filed 2012·Granted May 20, 2014·0 cites·10 claims
- 1940US2012211762A1Semiconductor device, method of manufacturing semiconductor device and electronic circuitIMADA TADAHIRO·Filed 2011·Application pending·0 cites
- 2037US2012211764A1Semiconductor device and method for manufacturing semiconductor deviceOKAMOTO KEISHIRO·Filed 2012·Application pending·0 cites
- 2136US2012217626A1Semiconductor device and method for manufacturing semiconductor deviceSAKAI TAIJI·Filed 2012·Application pending·0 cites
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