Inventor · disambiguated record
Darrel E. Peugh
Also filed as: PEUGH DARREL E · PEUGH DARREL EUGENE
11 granted patents·2 pending applications·674 citations·filing 1998–2007
93Inventor score
Top patents by PatentIndex Score
13 records- 0197US7551439B2Fluid cooled electronic assemblyDELPHI TECH INC·Filed 2006·Granted Jun 23, 2009·106 cites·17 claims
- 0295US7365981B2Fluid-cooled electronic systemDELPHI TECH INC·Filed 2005·Granted Apr 29, 2008·48 cites·8 claims
- 0394US7215547B2Integrated cooling system for electronic devicesDELPHI TECH INC·Filed 2004·Granted May 8, 2007·87 cites·31 claims
- 0493US6156980AFlip chip on circuit board with enhanced heat dissipation and method thereforDELCO ELECTRONICS CORP·Filed 1998·Granted Dec 5, 2000·149 cites·20 claims
- 0590US7538425B2Power semiconductor package having integral fluid coolingDELPHI TECH INC·Filed 2004·Granted May 26, 2009·74 cites·7 claims
- 0683US6833628B2Mutli-chip moduleDELPHI TECH INC·Filed 2002·Granted Dec 21, 2004·33 cites·15 claims
- 0783US6535396B1Combination circuit board and segmented conductive bus substrateDELPHI TECH INC·Filed 2000·Granted Mar 18, 2003·36 cites·13 claims
- 0878US5953814AProcess for producing flip chip circuit board assembly exhibiting enhanced reliabilityDELCO ELECTRONICS CORP·Filed 1998·Granted Sep 21, 1999·87 cites·14 claims
- 0975US6560110B1Corrosive resistant flip chip thermal management structureDELPHI TECH INC·Filed 2002·Granted May 6, 2003·19 cites·26 claims
- 1071US7106588B2Power electronic system with passive coolingDELPHI TECH INC·Filed 2003·Granted Sep 12, 2006·18 cites·21 claims
- 1147US6045032AMethod of preventing solder reflow of electrical components during wave solderingDELCO ELECTRONICS CORP·Filed 1998·Granted Apr 4, 2000·17 cites·20 claims
- 1242US2005093144A1Multi-chip moduleDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1340US2008290378A1Transistor package with wafer level dielectric isolationMYERS BRUCE A·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →