Inventor · disambiguated record
Nicholas Neal
Also filed as: NEAL NICHOLAS
19 granted patents·6 pending applications·14 citations·filing 2017–2025
90Inventor score
Files withINTEL CORP25
Top patents by PatentIndex Score
25 records- 0194US12261150B2Mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0294US12087731B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Sep 10, 2024·1 cites·18 claims
- 0386US10553548B2Methods of forming multi-chip package structuresINTEL CORP·Filed 2017·Granted Feb 4, 2020·6 cites·8 claims
- 0483US12266589B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0579US11901333B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2019·Granted Feb 13, 2024·1 cites·25 claims
- 0678US2025192101A1No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 0777US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0877US12057369B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0977US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 1076US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1175US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1275US2025191998A1Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2025·Application pending·0 cites
- 1374US11640929B2Thermal management solutions for cored substratesINTEL CORP·Filed 2018·Granted May 2, 2023·2 cites·20 claims
- 1468US11854935B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 1568US11804418B2Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditionsINTEL CORP·Filed 2019·Granted Oct 31, 2023·1 cites·20 claims
- 1655US11942393B2Substrate with thermal insulationINTEL CORP·Filed 2020·Granted Mar 26, 2024·0 cites·16 claims
- 1754US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 1851US11901262B2Cooling solution including microchannel arrays and methods of forming the sameINTEL CORP·Filed 2019·Granted Feb 13, 2024·0 cites·16 claims
- 1951US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 2050US10461011B2Microelectronics package with an integrated heat spreader having indentationsINTEL CORP·Filed 2017·Granted Oct 29, 2019·0 cites·25 claims
- 2149US11594463B2Substrate thermal layer for heat spreader connectionINTEL CORP·Filed 2018·Granted Feb 28, 2023·0 cites·17 claims
- 2247US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 2347US11587843B2Thermal bump networks for integrated circuit device assembliesINTEL CORP·Filed 2018·Granted Feb 21, 2023·0 cites·20 claims
- 2445US2021249330A1Composite thermal matrixINTEL CORP·Filed 2020·Application pending·0 cites
- 2541US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →