Inventor · disambiguated record
Aaron Mccann
Also filed as: MCCANN AARON
7 granted patents·3 pending applications·0 citations·filing 2018–2025
70Inventor score
Technology areasH10W
Files withINTEL CORP10
Top patents by PatentIndex Score
10 records- 0183US12266589B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0277US12057369B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0375US2025191998A1Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0468US11854935B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 0551US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 0647US11869824B2Thermal interface structures for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 9, 2024·0 cites·25 claims
- 0744US11769753B2Thermally-optimized tunable stack in cavity package-on-packageINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·11 claims
- 0844US11679407B2Liquid metal thermal interface material applicationINTEL CORP·Filed 2020·Granted Jun 20, 2023·0 cites·9 claims
- 0942US2021125896A1Filled liquid metal thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 1040US2021272885A1Interposer heat spreaderINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →