Inventor · disambiguated record
Hui-Jae Kim
Also filed as: KIM HUI-JAE
4 granted patents·7 citations·filing 2014–2017
64Inventor score
Top patents by PatentIndex Score
4 records- 0173US9431365B2Apparatus for bonding semiconductor chipsSEOK SEUNG-DAE·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 0270US10058952B2Bonding stage and bonding apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·16 claims
- 0356US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0431US10784130B2Bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →