Inventor · disambiguated record
Jun Ho Won
Also filed as: WON JUN HO
11 granted patents·6 pending applications·59 citations·filing 2006–2017
86Inventor score
Files withSILICONFILE TECHNOLOGIES INC7SILICONFILE TECH INC4JEON IN GYUN3AHN HEUI GYUN1LEE BYOUNG SU1
Top patents by PatentIndex Score
17 records- 0194US7714403B2Image sensor using back-illuminated photodiode and method of manufacturing the sameSILICONFILE TECHNOLOGIES INC·Filed 2007·Granted May 11, 2010·33 cites·7 claims
- 0289US9553120B2Image sensor using backside illumination photodiode and method for manufacturing the sameSILICONFILE TECH INC·Filed 2014·Granted Jan 24, 2017·8 cites·8 claims
- 0388US8421134B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2010·Granted Apr 16, 2013·7 cites·3 claims
- 0484US9484377B2CMOS image sensor including infrared pixels having improved spectral properties, and method of manufacturing sameSILICONFILE TECH INC·Filed 2013·Granted Nov 1, 2016·6 cites·12 claims
- 0579US10962477B2Wide-angle emission filter, optical sensor assembly having the same, PCR system having the same, and method of manufacturing the sameOPTOLANE TECH INC·Filed 2017·Granted Mar 30, 2021·3 cites·11 claims
- 0674US8420429B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2012·Granted Apr 16, 2013·1 cites·5 claims
- 0763US8816459B2Image sensor having wave guide and method for manufacturing the sameJEON IN-GYUN·Filed 2012·Granted Aug 26, 2014·0 cites·9 claims
- 0862US8399282B2Method for forming pad in wafer with three-dimensional stacking structureAHN HEUI GYUN·Filed 2011·Granted Mar 19, 2013·1 cites·16 claims
- 0961US2016300875A1Substrate separation-type three-dimensional chip stacking image sensor and method for manufacturing sameSILICONFILE TECH INC·Filed 2014·Application pending·0 cites
- 1057US8368158B2Image sensor having wave guide and method for manufacturing the sameSILICONFILE TECHNOLOGIES INC·Filed 2010·Granted Feb 5, 2013·0 cites·17 claims
- 1157US2015325618A1Cmos image sensor including color microlens, and method for manufacturing sameSILICONFILE TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 1253US2009058993A1Cmos stereo camera for obtaining three-dimensional imageSILICONFILE TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 1353US2008296713A1Image Sensor with Color Filters and Method of Manufacturing the SameLEE BYOUNG SU·Filed 2006·Application pending·0 cites
- 1451US8993411B2Method for forming pad in wafer with three-dimensional stacking structureSILICONFILE TECHNOLOGIES INC·Filed 2013·Granted Mar 31, 2015·0 cites·14 claims
- 1551US7898011B2Image sensor having anti-reflection film for reducing crosstalkSILICONFILE TECHNOLOGIES INC·Filed 2006·Granted Mar 1, 2011·0 cites·4 claims
- 1647US2017237911A1Image sensor having improved spectral characteristicsSILICONFILE TECH INC·Filed 2014·Application pending·0 cites
- 1739US2015155323A1Chip-stacked image sensor having heterogeneous junction structure and method for manufacturing sameSILICONFILE TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →