Inventor · disambiguated record
Kwet Nam Wong
Also filed as: WONG KWET NAM
5 granted patents·1 pending application·6 citations·filing 2007–2010
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0163US7759171B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageSPANSION LLC·Filed 2007·Granted Jul 20, 2010·4 cites·14 claims
- 0261US7674653B2Die offset die to bondingSPANSION LLC·Filed 2008·Granted Mar 9, 2010·2 cites·3 claims
- 0349US7750481B2Die offset die to die bondingSPANSION LLC·Filed 2008·Granted Jul 6, 2010·0 cites·5 claims
- 0446US7554204B2Die offset die to die bondingSPANSION LLC·Filed 2007·Granted Jun 30, 2009·0 cites·8 claims
- 0537US2009051043A1Die stacking in multi-die stacks using die support mechanismsSPANSION LLC·Filed 2007·Application pending·0 cites
- 0633US8546936B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageHUSSIN PAKHORUDIN·Filed 2010·Granted Oct 1, 2013·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Kwet Nam Wong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →