Inventor · disambiguated record
Nguk Chin Lai
Also filed as: LAI NGUK CHIN
3 granted patents·1 pending application·2 citations·filing 2007–2008
55Inventor score
Technology areasH10W
Files withSPANSION LLC4
Top patents by PatentIndex Score
4 records- 0161US7674653B2Die offset die to bondingSPANSION LLC·Filed 2008·Granted Mar 9, 2010·2 cites·3 claims
- 0249US7750481B2Die offset die to die bondingSPANSION LLC·Filed 2008·Granted Jul 6, 2010·0 cites·5 claims
- 0346US7554204B2Die offset die to die bondingSPANSION LLC·Filed 2007·Granted Jun 30, 2009·0 cites·8 claims
- 0437US2009051043A1Die stacking in multi-die stacks using die support mechanismsSPANSION LLC·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Nguk Chin Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →