Inventor · disambiguated record
Calvin K. Li
Also filed as: LI CALVIN · LI CALVIN K
16 granted patents·2 pending applications·589 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
18 records- 0199US6627530B2Patterning three dimensional structuresMATRIX SEMICONDUCTOR INC·Filed 2000·Granted Sep 30, 2003·385 cites·30 claims
- 0292US8154005B2Non-volatile memory arrays comprising rail stacks with a shared diode component portion for diodes of electrically isolated pillarsHSIA KANG-JAY·Filed 2008·Granted Apr 10, 2012·23 cites·17 claims
- 0392US7814084B2Contact information capture and link redirectionSCHMAP INC·Filed 2008·Granted Oct 12, 2010·74 cites·17 claims
- 0490US8633105B2Method of fabricating a self-aligning damascene memory structureSANDISK 3D LLC·Filed 2013·Granted Jan 21, 2014·9 cites·18 claims
- 0588US7629247B2Method of fabricating a self-aligning damascene memory structureSANDISK 3D LLC·Filed 2007·Granted Dec 8, 2009·14 cites·26 claims
- 0679US7071565B2Patterning three dimensional structuresSANDISK 3D LLC·Filed 2002·Granted Jul 4, 2006·17 cites·16 claims
- 0776US6649451B1Structure and method for wafer comprising dielectric and semiconductorMATRIX SEMICONDUCTOR INC·Filed 2001·Granted Nov 18, 2003·23 cites·32 claims
- 0875US9082786B2Method of fabricating a self-aligning damascene memory structureSANDISK 3D LLC·Filed 2013·Granted Jul 14, 2015·2 cites·20 claims
- 0975US8389399B2Method of fabricating a self-aligning damascene memory structureHSIA KANG-JAY·Filed 2009·Granted Mar 5, 2013·5 cites·33 claims
- 1073US7927990B2Forming complimentary metal features using conformal insulator layerSANDISK 3D LLC·Filed 2007·Granted Apr 19, 2011·6 cites·23 claims
- 1171US7830028B2Semiconductor test structuresSANDISK CORP·Filed 2007·Granted Nov 9, 2010·3 cites·17 claims
- 1271US6770939B2Thermal processing for three dimensional circuitsMATRIX SEMICONDUCTOR INC·Filed 2002·Granted Aug 3, 2004·13 cites·24 claims
- 1369US7998640B2Mask reuse in semiconductor processingSANDISK CORP·Filed 2007·Granted Aug 16, 2011·4 cites·18 claims
- 1467US6624011B1Thermal processing for three dimensional circuitsMATRIX SEMICONDUCTOR INC·Filed 2000·Granted Sep 23, 2003·11 cites·26 claims
- 1554US2024070612A1System and method for inventorying, displaying, monitoring, and selection of fauna itemsPafe Plants LLC·Filed 2023·Application pending·0 cites
- 1648US8748859B2Non-volatile memory arrays comprising rail stacks with a shared diode component portion for diodes of electrically isolated pillarsHSIA KANG-JAY·Filed 2012·Granted Jun 10, 2014·0 cites·18 claims
- 1744US7932157B2Test structure formation in semiconductor processingSANDISK CORP·Filed 2007·Granted Apr 26, 2011·0 cites·20 claims
- 1837US2012049186A1Semiconductor structuresLI CALVIN K·Filed 2010·Application pending·0 cites
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