Inventor · disambiguated record
William M. Beckenbaugh
Also filed as: BECKENBAUGH WILLIAM · BECKENBAUGH WILLIAM M · BECKENBAUGH WILLIAM MAX
18 granted patents·623 citations·filing 1977–2021
95Inventor score
Top patents by PatentIndex Score
18 records- 0191US5229070ALow temperature-wetting tin-base solder pasteMOTOROLA INC·Filed 1992·Granted Jul 20, 1993·79 cites·17 claims
- 0290US5194137ASolder plate reflow method for forming solder-bumped terminalsMOTOROLA INC·Filed 1991·Granted Mar 16, 1993·69 cites·19 claims
- 0388US5593903AMethod of forming contact pads for wafer level testing and burn-in of semiconductor diceMOTOROLA INC·Filed 1996·Granted Jan 14, 1997·128 cites·22 claims
- 0487US4261800AMethod of selectively depositing a metal on a surface of a substrateWESTERN ELECTRIC CO·Filed 1977·Granted Apr 14, 1981·55 cites·15 claims
- 0580US5160409ASolder plate reflow method for forming a solder bump on a circuit trace intersectionMOTOROLA INC·Filed 1991·Granted Nov 3, 1992·70 cites·14 claims
- 0677US5086966APalladium-coated solder ballMOTOROLA INC·Filed 1990·Granted Feb 11, 1992·41 cites·5 claims
- 0771US4167601AMethod of depositing a stress-free electroless copper depositWESTERN ELECTRIC CO·Filed 1978·Granted Sep 11, 1979·21 cites·45 claims
- 0870US5848466AMethod for forming a microelectronic assemblyMOTOROLA INC·Filed 1996·Granted Dec 15, 1998·34 cites·18 claims
- 0969US5429292ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1994·Granted Jul 4, 1995·27 cites·6 claims
- 1069US4181750AMethod of depositing a metal on a surfaceWESTERN ELECTRIC CO·Filed 1977·Granted Jan 1, 1980·20 cites·24 claims
- 1168US11832394B2Sensing decalPERATECH HOLDCO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·11 claims
- 1264US4268536AMethod for depositing a metal on a surfaceWESTERN ELECTRIC CO·Filed 1980·Granted May 19, 1981·23 cites·9 claims
- 1359US5377027ALiquid crystal display device with pixel registration illuminationMOTOROLA INC·Filed 1992·Granted Dec 27, 1994·23 cites·6 claims
- 1456US11234333B2Sensing decalPERATECH HOLDCO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·9 claims
- 1555US4228213AMethod of depositing a stress-free electroless copper depositWESTERN ELECTRIC CO·Filed 1979·Granted Oct 14, 1980·12 cites·41 claims
- 1654US5389160ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1993·Granted Feb 14, 1995·14 cites·4 claims
- 1749US11385114B2Force detecting sensorPERATECH HOLDCO LTD·Filed 2018·Granted Jul 12, 2022·0 cites·18 claims
- 1839US4304849AMethods of depositing metallic copper on substratesWESTERN ELECTRIC CO·Filed 1980·Granted Dec 8, 1981·7 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when William M. Beckenbaugh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →