Inventor · disambiguated record
Bo-Sun Hwang
Also filed as: HWANG BO-SUN
2 granted patents·3 citations·filing 2013–2013
42Inventor score
Top patents by PatentIndex Score
2 records- 0164US9465900B2System and method for designing semiconductor package using computing system, apparatus for fabricating semiconductor package including the system, and semiconductor package designed by the methodJEONG JAE-HOON·Filed 2013·Granted Oct 11, 2016·2 cites·29 claims
- 0257US8856714B2Method and system for designing 3D semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 7, 2014·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →