Inventor · disambiguated record
Reza A. Pagaila
Also filed as: PAGAILA REZA A · PAGAILA REZA ARGENTY
192 granted patents·13 pending applications·3,565 citations·filing 2008–2017
99Inventor score
Files withSTATS CHIPPAC LTD78PAGAILA REZA A77PAGAILA REZA ARGENTY20DO BYUNG TAI15JCET SEMICONDUCTOR SHAOXING CO LTD4
Top patents by PatentIndex Score
205 records- 0199US8518746B2Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor diePAGAILA REZA A·Filed 2010·Granted Aug 27, 2013·98 cites·20 claims
- 0299US8354297B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 15, 2013·125 cites·25 claims
- 0399US8097490B1Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 17, 2012·155 cites·20 claims
- 0499US8080445B1Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposersPAGAILA REZA A·Filed 2010·Granted Dec 20, 2011·94 cites·12 claims
- 0598US9893045B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2015·Granted Feb 13, 2018·33 cites·19 claims
- 0698US9508626B2Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package heightPAGAILA REZA A·Filed 2010·Granted Nov 29, 2016·50 cites·26 claims
- 0798US9406619B2Semiconductor device including pre-fabricated shielding frame disposed over semiconductor diePAGAILA REZA A·Filed 2012·Granted Aug 2, 2016·46 cites·24 claims
- 0898US9054095B2Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposersPAGAILA REZA A·Filed 2011·Granted Jun 9, 2015·50 cites·32 claims
- 0998US8940636B2Through hole vias at saw streets including protrusions or recesses for interconnectionPAGAILA REZA A·Filed 2011·Granted Jan 27, 2015·39 cites·21 claims
- 1098US8796137B2Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnectPAGAILA REZA A·Filed 2010·Granted Aug 5, 2014·47 cites·26 claims
- 1198US8742579B2Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2012·Granted Jun 3, 2014·101 cites·25 claims
- 1298US8349735B2Semiconductor device and method of forming conductive TSV with insulating annular ringSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·44 cites·25 claims
- 1398US8288201B2Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor diePAGAILA REZA A·Filed 2010·Granted Oct 16, 2012·63 cites·25 claims
- 1498US8283205B2Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2012·Granted Oct 9, 2012·47 cites·19 claims
- 1598US8268677B1Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposerPAGAILA REZA A·Filed 2011·Granted Sep 18, 2012·36 cites·31 claims
- 1698US8263434B2Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoPPAGAILA REZA A·Filed 2009·Granted Sep 11, 2012·110 cites·20 claims
- 1798US8193034B2Semiconductor device and method of forming vertical interconnect structure using stud bumpsPAGAILA REZA A·Filed 2009·Granted Jun 5, 2012·72 cites·20 claims
- 1898US8133762B2Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2009·Granted Mar 13, 2012·84 cites·22 claims
- 1998US8039304B2Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structuresSTATS CHIPPAC LTD·Filed 2009·Granted Oct 18, 2011·60 cites·20 claims
- 2098US7955942B2Semiconductor device and method of forming a 3D inductor from prefabricated pillar frameSTATS CHIPPAC LTD·Filed 2009·Granted Jun 7, 2011·57 cites·13 claims
- 2198US7799602B2Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structureSTATS CHIPPAC LTD·Filed 2008·Granted Sep 21, 2010·72 cites·20 claims
- 2298US7772046B2Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interferenceSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·81 cites·19 claims
- 2398US7741156B2Semiconductor device and method of forming through vias with reflowed conductive materialSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·59 cites·8 claims
- 2498US7618846B1Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Nov 17, 2009·92 cites·19 claims
- 2597US9324672B2Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale packagePAGAILA REZA A·Filed 2009·Granted Apr 26, 2016·63 cites·20 claims
- 2697US8896109B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Nov 25, 2014·39 cites·24 claims
- 2797US8822281B2Semiconductor device and method of forming TMV and TSV in WLCSP using same carrierPAGAILA REZA A·Filed 2010·Granted Sep 2, 2014·32 cites·25 claims
- 2897US8558392B2Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulantCHUA LINDA PEI EE·Filed 2010·Granted Oct 15, 2013·65 cites·45 claims
- 2997US8492201B2Semiconductor device and method of forming through vias with reflowed conductive materialPAGAILA REZA A·Filed 2010·Granted Jul 23, 2013·29 cites·32 claims
- 3097US8435835B2Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor diePAGAILA REZA A·Filed 2010·Granted May 7, 2013·33 cites·16 claims
- 3197US8278141B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2008·Granted Oct 2, 2012·54 cites·19 claims
- 3297US8258012B2Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor diePAGAILA REZA A·Filed 2010·Granted Sep 4, 2012·25 cites·25 claims
- 3397US8105872B2Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 31, 2012·25 cites·20 claims
- 3497US8021907B2Method and apparatus for thermally enhanced semiconductor packageSTATS CHIPPAC LTD·Filed 2008·Granted Sep 20, 2011·43 cites·18 claims
- 3597US7666711B2Semiconductor device and method of forming double-sided through vias in saw streetsSTATS CHIPPAC LTD·Filed 2008·Granted Feb 23, 2010·53 cites·20 claims
- 3697US7648911B2Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole viasSTATS CHIPPAC LTD·Filed 2008·Granted Jan 19, 2010·44 cites·19 claims
- 3796US8633059B2Integrated circuit packaging system with interconnect and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 21, 2014·23 cites·12 claims
- 3896US8383457B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·22 cites·20 claims
- 3996US8378477B2Integrated circuit packaging system with film encapsulation and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 19, 2013·31 cites·20 claims
- 4096US8258010B2Making a semiconductor device having conductive through organic viasPAGAILA REZA A·Filed 2009·Granted Sep 4, 2012·41 cites·29 claims
- 4196US8168458B2Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devicesDO BYUNG TAI·Filed 2008·Granted May 1, 2012·37 cites·25 claims
- 4296US8101460B2Semiconductor device and method of shielding semiconductor die from inter-device interferencePAGAILA REZA A·Filed 2008·Granted Jan 24, 2012·44 cites·25 claims
- 4396US8097489B2Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor diePAGAILA REZA A·Filed 2009·Granted Jan 17, 2012·36 cites·20 claims
- 4496US8021930B2Semiconductor device and method of forming dam material around periphery of die to reduce warpageSTATS CHIPPAC LTD·Filed 2009·Granted Sep 20, 2011·40 cites·24 claims
- 4596US7859085B2Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole viasSTATS CHIPPAC LTD·Filed 2009·Granted Dec 28, 2010·33 cites·24 claims
- 4696US7704796B2Semiconductor device and method of forming recessed conductive vias in saw streetsSTATS CHIPPAC LTD·Filed 2008·Granted Apr 27, 2010·40 cites·20 claims
- 4796US7659145B2Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Feb 9, 2010·38 cites·20 claims
- 4895US9875911B2Semiconductor device and method of forming interposer with opening to contain semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 23, 2018·19 cites·11 claims
- 4995US9337116B2Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor diePAGAILA REZA A·Filed 2010·Granted May 10, 2016·20 cites·38 claims
- 5095US8861221B2Integrated circuit packaging system with a shield and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2010·Granted Oct 14, 2014·23 cites·20 claims
Showing the top 50 of 205 patent records by PatentIndex Score.
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