Inventor · disambiguated record
Wan-Ting Shih
Also filed as: SHIH WAN-TING
10 granted patents·1,051 citations·filing 2011–2020
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6IND TECH RES INST2LIN JING-CHENG1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
10 records- 0198US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 0295US9824989B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 21, 2017·16 cites·20 claims
- 0383US9312148B2Method of packaging a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 12, 2016·3 cites·20 claims
- 0481US10911113B2Communication system and codec method based on deep learning and known channel state informationIND TECH RES INST·Filed 2019·Granted Feb 2, 2021·4 cites·16 claims
- 0580US10771143B1Switching method for multiple antenna arrays and electronic device applying the sameIND TECH RES INST·Filed 2019·Granted Sep 8, 2020·5 cites·10 claims
- 0671US11532577B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 0769US9953907B2PoP deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 24, 2018·2 cites·19 claims
- 0863US10741511B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 0958US10366960B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·20 claims
- 1051US10867897B2PoP deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →