Inventor · disambiguated record
Hak-Kyoon Byun
Also filed as: BYUN HAK · BYUN HAK K · BYUN HAK-KYOON
10 granted patents·10 pending applications·87 citations·filing 2002–2014
88Inventor score
Top patents by PatentIndex Score
20 records- 0194US7795743B2Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 14, 2010·37 cites·26 claims
- 0287US8531034B2Semiconductor package and package on package having the sameBYUN HAK-KYOON·Filed 2011·Granted Sep 10, 2013·9 cites·20 claims
- 0383US7624498B2Apparatus for detaching a semiconductor chip from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·10 cites·18 claims
- 0482US7541680B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·13 cites·9 claims
- 0581US8759967B2Semiconductor package and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 24, 2014·4 cites·14 claims
- 0673US9111926B2Semiconductor package and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 18, 2015·2 cites·12 claims
- 0768US8184449B2Electronic device having stack-type semiconductor package and method of forming the sameLEE JUNG-DO·Filed 2008·Granted May 22, 2012·5 cites·20 claims
- 0859US9245863B2Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heightsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·13 claims
- 0953US8304876B2Semiconductor package and method for manufacturing the sameBYUN HAK-KYOON·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 1053US2010037445A1Method of and apparatus for detaching semiconductor chips from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1148US6657272B2Off-axis silicon substrate for optimized optical couplingTRIQUINT TECHNOLOGY HOLDING CO·Filed 2002·Granted Dec 2, 2003·5 cites·18 claims
- 1245US2008160725A1Semiconductor die pick up apparatus and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1345US2008160724A1Method of dicingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1444US2008064215A1Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1542US2009085185A1Stack-type semiconductor package, method of forming the same and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1641US2008111224A1Multi stack package and method of fabricating the sameBYUN HAK-KYOON·Filed 2007·Application pending·0 cites
- 1739US2013178016A1Methods of fabricating a package-on-package device and package-on-package devices fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1838US2004037024A1Optoelectronic packageFiled 2003·Application pending·0 cites
- 1937US2013161800A1Pcb for muf and molding structure of the pcbSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2029US2012315726A1Method of manufacturing a semiconductor chip packageBYUN HAK-KYOON·Filed 2012·Application pending·0 cites
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