Inventor · disambiguated record
Bo Su
Also filed as: SU BO · SU BO-YU
25 granted patents·15 pending applications·68 citations·filing 2007–2024
92Inventor score
Files withSEMICONDUCTOR MFG INT SHANGHAI CORP22UNITED MICROELECTRONICS CORP10PENUMBRA INC2HU CHENMIN1JUST MEDICAL DEVICES TIANJIN CO LTD1
Top patents by PatentIndex Score
40 records- 0196US10062764B1Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·19 cites·10 claims
- 0292US7962863B2Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a waferKLA TENCOR CORP·Filed 2008·Granted Jun 14, 2011·19 cites·19 claims
- 0391US8102408B2Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designsVERMA GAURAV·Filed 2007·Granted Jan 24, 2012·23 cites·21 claims
- 0488US10170573B1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·6 cites·10 claims
- 0573US11239082B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 1, 2022·1 cites·8 claims
- 0670US11742427B2Semiconductor deviceSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Granted Aug 29, 2023·0 cites·7 claims
- 0769US11881518B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·5 claims
- 0868US11929418B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 12, 2024·0 cites·17 claims
- 0962US12239777B2Thrombectomy systems and methods for controlled clot aspirationPENUMBRA INC·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 1060US11309420B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Apr 19, 2022·0 cites·13 claims
- 1160US2024180350A1Cooking deviceZHUHAI UNICOOK TECH CO LTD·Filed 2022·Application pending·0 cites
- 1259US12463049B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Granted Nov 4, 2025·0 cites·21 claims
- 1359US2024203877A1Semiconductor structure and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 1458US11205705B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 21, 2021·0 cites·7 claims
- 1558US10468493B2Method for manufacturing gate stack structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 5, 2019·0 cites·9 claims
- 1657US2025255640A1Vascular occlusion detection from motorized separator torque measurement signalPENUMBRA INC·Filed 2024·Application pending·0 cites
- 1755US12403215B2Oxide layer-containing zirconium-niobium alloy shoulder joint prosthesis system and preparation methodJUST MEDICAL DEVICES TIANJIN CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·10 claims
- 1855US10388749B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 20, 2019·0 cites·8 claims
- 1954US10186594B2Semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 22, 2019·0 cites·6 claims
- 2054US2024224490A1Semiconductor structure and method of forming semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 2154US2024222486A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2253US2024063298A1Semiconductor structure and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2353US2024332400A1Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 2452US11211475B2Semiconductor device and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 2552US10366896B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 30, 2019·0 cites·7 claims
- 2650US2023100058A1Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2022·Application pending·0 cites
- 2750US2023223452A1Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2850US2023238449A1Semiconductor structure and forming method thereforSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2950US2023402530A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3049US11664227B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted May 30, 2023·0 cites·19 claims
- 3149US2023369328A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3249US2024313078A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Application pending·0 cites
- 3348US11605726B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Mar 14, 2023·0 cites·14 claims
- 3447US12283517B2Method for forming semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Apr 22, 2025·0 cites·18 claims
- 3547US11551924B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Jan 10, 2023·0 cites·19 claims
- 3647US11393685B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Jul 19, 2022·0 cites·18 claims
- 3746US11538685B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Dec 27, 2022·0 cites·18 claims
- 3846US2023411398A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Application pending·0 cites
- 3942US11183395B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Nov 23, 2021·0 cites·14 claims
- 4036US2012259574A1Designed-based yield management systemHU CHENMIN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bo Su files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →