Inventor · disambiguated record
Ritsuo Takizawa
Also filed as: TAKIZAWA RITSUO
19 granted patents·349 citations·filing 1993–2014
96Inventor score
Top patents by PatentIndex Score
19 records- 0197US8035708B2Solid-state imaging device with an organic photoelectric conversion film and imaging apparatusSONY CORP·Filed 2008·Granted Oct 11, 2011·49 cites·4 claims
- 0292US8017984B2Solid-state imaging deviceSONY CORP·Filed 2008·Granted Sep 13, 2011·13 cites·1 claims
- 0389US7821093B2Solid-state imaging device with biased light shielding filmSONY CORP·Filed 2008·Granted Oct 26, 2010·8 cites·6 claims
- 0488US8670054B2Solid-state image pickup device with isolated organic photoelectric conversion film portions, method for manufacturing the same, and image pickup apparatusTAKIZAWA RITSUO·Filed 2010·Granted Mar 11, 2014·10 cites·15 claims
- 0586US8598640B2Solid-state imaging deviceKITANO YOSHIAKI·Filed 2011·Granted Dec 3, 2013·6 cites·3 claims
- 0685US5734195ASemiconductor wafer for epitaxially grown devices having a sub-surface getter regionSONY CORP·Filed 1996·Granted Mar 31, 1998·63 cites·17 claims
- 0783US7473977B2Method of driving solid state image sensing deviceSONY CORP·Filed 2004·Granted Jan 6, 2009·15 cites·3 claims
- 0882US7791118B2Solid-state imaging deviceSONY CORP·Filed 2008·Granted Sep 7, 2010·4 cites·8 claims
- 0979US7935563B2Solid-state imaging device and method for manufacturing thereof as well as driving method of solid-state imaging deviceSONY CORP·Filed 2008·Granted May 3, 2011·3 cites·2 claims
- 1079US7928487B2Solid-state imaging device and driving method of solid-state imaging deviceSONY CORP·Filed 2008·Granted Apr 19, 2011·3 cites·3 claims
- 1174US8101999B2SOI substrate and method for producing the same, solid-state image pickup device and method for producing the same, and image pickup apparatusTAKIZAWA RITSUO·Filed 2009·Granted Jan 24, 2012·6 cites·12 claims
- 1273US5874348ASemiconductor wafer and method of manufacturing sameSONY CORP·Filed 1996·Granted Feb 23, 1999·34 cites·11 claims
- 1372US6342436B1Method of manufacturing semiconductor substrate and method of manufacturing solid-state image-pickup deviceSONY CORP·Filed 1999·Granted Jan 29, 2002·38 cites·16 claims
- 1466US6746939B2Production method for solid imaging deviceSONY CORP·Filed 2002·Granted Jun 8, 2004·17 cites·7 claims
- 1563US5506176AMethod of making a semiconductor device having a process of hydrogen annealingSONY CORP·Filed 1993·Granted Apr 9, 1996·32 cites·5 claims
- 1660US6140213ASemiconductor wafer and method of manufacturing sameSONY CORP·Filed 1998·Granted Oct 31, 2000·19 cites·28 claims
- 1759US9202847B2Solid-state image pickup device having an organic photoelectric conversion film, method for manufacturing the same, and image pickup apparatusSONY CORP·Filed 2014·Granted Dec 1, 2015·0 cites·20 claims
- 1852US5956570AMethod of manufacturing semiconductor substrate and method of manufacturing solid state imaging deviceSONY CORP·Filed 1997·Granted Sep 21, 1999·16 cites·8 claims
- 1947US6344092B1Epitaxial semiconductor substrate, manufacturing method thereof, manufacturing method of semiconductor device and manufacturing method of solid-state imaging deviceSONY CORP·Filed 1999·Granted Feb 5, 2002·13 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →