Inventor · disambiguated record
Sohichi Kadoguchi
Also filed as: KADOGUCHI SOHICHI
4 granted patents·2 pending applications·23 citations·filing 2003–2010
70Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC6
Top patents by PatentIndex Score
6 records- 0163US7404513B2Wire bonds having pressure-absorbing ballsTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 29, 2008·13 cites·13 claims
- 0259US6768212B2Semiconductor packages and methods for manufacturing such semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 27, 2004·10 cites·10 claims
- 0345US2008251918A1Wire Bonds Having Pressure-Absorbing BallsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 0443US7926698B2Spot heat wirebondingTEXAS INSTRUMENTS INC·Filed 2010·Granted Apr 19, 2011·0 cites·8 claims
- 0543US7677432B2Spot heat wirebondingTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 16, 2010·0 cites·1 claims
- 0639US2007200234A1Flip-Chip Device Having Underfill in Controlled GapTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →